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SCAN16602SM

Texas Instruments

SCAN16602SM by Texas Instruments

The Texas Instruments SCAN16602SM is a 16-bit line transceiver with a max supply voltage of 3.6V and operates in industrial temperature range (-40 to 85°C). It features a low profile, fine pitch grid array package and IEEE 1149.1 interface standard, making it ideal for high-speed data transmission applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,683 parts In-Stock

1+ parts

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7,683

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Digiode

USA . 2,818 parts In-Stock

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2,818

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Anansix

USA . 467 parts In-Stock

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467

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 538 parts In-Stock

1+ parts

$5.500

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538

$5.500

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Parana Technologies

USA . 1,724 parts In-Stock

1+ parts

$8.197

100+ parts

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$8.807

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1,724

$8.197

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$8.807

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DigiPath Technology Company

USA . 1,924 parts In-Stock

1+ parts

$9.026

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1,924

$9.026

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ChromeModa Solutions

Germany . 3,328 parts In-Stock

1+ parts

$9.210

100+ parts

$7.552

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3,328

$9.210

$7.552

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IDEA Electronic Components Group

UK . 332 parts In-Stock

1+ parts

$9.210

100+ parts

$8.750

1k+ parts

$8.289

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332

$9.210

$8.750

$8.289

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AZTECH Wire

Italy . 336 parts In-Stock

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$16.829

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336

$16.829

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Corphita

USA . 2,649 parts In-Stock

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2,649

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Overview

Discover the power of the SCAN16602SM by Texas Instruments, a top-of-the-line line driver and receiver that offers unmatched quality and reliability. With 16 functions packed into a compact square package, this innovative product is perfect for a wide range of applications. From industrial to commercial use, the SCAN16602SM delivers exceptional value, efficiency, and performance. Trust in Texas Instruments' reputation for excellence and take your projects to the next level with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and reliability for the product.

Surface Mount: YES

Allows for easy and convenient installation on PCBs.

Maximum Supply Voltage: 3.6 V

Can handle relatively high voltage levels for versatile applications.

No. of Functions: 16

Offers multiple functions in a single component, allowing for efficient design.

Package Shape: SQUARE

Helps in optimizing space utilization on the circuit board.

Maximum Transmit Delay: 5.5 ns

Provides fast operation, suitable for high-speed data transmission.

No. of Terminals: 64

Sufficient terminals for connecting to various external components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables compact and low-profile design for space-constrained applications.

Minimum Supply Voltage: 2.7 V

Works at low supply voltage, suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

Allows for operation in a wide temperature range for versatility.

Minimum Operating Temperature: -40 °C

Can withstand harsh environmental conditions.

Terminal Finish: Tin/Lead (Sn63Pb37)

Provides good solderability and conductivity for reliable connections.

Terminal Position: BOTTOM

Facilitates easy PCB mounting and connection.

Maximum Seated Height: 1.5 mm

Low profile design for space-saving and slim form factor.

Width: 8 mm

Compact size for efficient PCB layout.

Receiver No. of Bits: 16

High number of bits for accurate and reliable data reception.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow time for proper soldering during assembly.

Peak Reflow Temperature °C: 235

Suitable reflow temperature for effective soldering.

Length: 8 mm

Compact size for efficient PCB layout and space-saving.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with varying temperature conditions.

Maximum Receive Delay: 5.5 ns

Minimal delay for quick and efficient data reception.

Terminal Form: BALL

Provides secure electrical connections and reliability.

Interface Standard: IEEE 1149.1

Compliance with industry standards for compatibility and interoperability.

Input Characteristics: STANDARD

Ensures compatibility with standard input signals.

Nominal Supply Voltage: 3 V

Optimal supply voltage for stable performance.

Terminal Pitch: 0.8 mm

Fine pitch for compact design and space efficiency.

Driver No. of Bits: 16

High number of bits for accurate and reliable data transmission.

Moisture Sensitivity Level (MSL): 3

Moderate sensitivity level suitable for standard handling and storage.

Interface IC Type: LINE TRANSCEIVER

Specific IC type for efficient line driving and receiving capabilities.

Technical Specifications

Line Drivers & Receivers SCAN16602SM attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

16

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

IEEE 1149.1

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e0

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

16

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Receive Delay:

5.5 ns

Receiver No. of Bits:

16

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn63Pb37)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

5.5 ns

Width:

8 mm

Trade Compliance

SCAN16602SM Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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