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SCAN25100TYA/NOPB

Texas Instruments

SCAN25100TYA/NOPB by Texas Instruments

SCAN25100TYA/NOPB by Texas Instruments is a Line Transceiver with 100 terminals, operating at -40 to 85°C. It features a differential output, with supply voltages of 1.8V and 3.3V. This IC is ideal for industrial applications requiring high-speed data transmission over short distances.

Median Price

$16.515

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,210 parts In-Stock

1+ parts

-

100+ parts

$14.680

1k+ parts

$13.130

10k+ parts

$12.360

6,210

-

$14.680

$13.130

$12.360

Verical

USA . 6,210 parts In-Stock

1+ parts

-

100+ parts

$18.350

1k+ parts

$16.413

10k+ parts

$15.450

6,210

-

$18.350

$16.413

$15.450

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,963 parts In-Stock

1+ parts

$15.494

100+ parts

-

1k+ parts

-

10k+ parts

-

3,963

$15.494

-

-

-

Vyrian

USA . 1,514 parts In-Stock

1+ parts

$16.310

100+ parts

-

1k+ parts

-

10k+ parts

-

1,514

$16.310

-

-

-

Anansix

USA . 1,717 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,717

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,035 parts In-Stock

1+ parts

$12.266

100+ parts

-

1k+ parts

$12.689

10k+ parts

-

1,035

$12.266

-

$12.689

-

ChromeModa Solutions

Germany . 4,701 parts In-Stock

1+ parts

$13.782

100+ parts

$11.301

1k+ parts

-

10k+ parts

-

4,701

$13.782

$11.301

-

-

IDEA Electronic Components Group

UK . 2,313 parts In-Stock

1+ parts

$13.782

100+ parts

$13.093

1k+ parts

$12.404

10k+ parts

-

2,313

$13.782

$13.093

$12.404

-

Corphita

USA . 1,286 parts In-Stock

1+ parts

$14.679

100+ parts

-

1k+ parts

-

10k+ parts

-

1,286

$14.679

-

-

-

Microchip USA

USA . 2,860 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,860

-

-

-

-

DigiPath Technology Company

USA . 967 parts In-Stock

1+ parts

-

100+ parts

$12.426

1k+ parts

-

10k+ parts

-

967

-

$12.426

-

-

Perfect Parts

USA . 90 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

90

-

-

-

-

Overview

Enhance your electronic designs with the SCAN25100TYA/NOPB by Texas Instruments, a top-of-the-line Line Driver & Receiver that delivers unparalleled quality and reliability. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product will exceed your expectations. From industrial applications to consumer electronics, this versatile component offers seamless integration and superior performance. Elevate your projects with the value, benefits, and advantages that only Texas Instruments can provide.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on circuit boards, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.465 V

Supports a high supply voltage, ensuring compatibility with a wide range of systems and applications.

Package Shape: SQUARE

Square package shape provides stability and ease of placement on the circuit board, improving overall reliability.

Power Supplies (V): 1.8,3.3

Supports multiple power supply voltages, offering flexibility and compatibility with various power sources.

No. of Terminals: 100

Large number of terminals allow for versatile connectivity options, making it suitable for complex systems.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Multiple package styles provide options for different installation requirements and design constraints.

Minimum Supply Voltage: 3.135 V

Low minimum supply voltage ensures efficient power consumption and compatibility with lower voltage systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable operation even in extreme cold environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal position allows for stable and secure connection, reducing the risk of signal loss or interference.

Maximum Seated Height: 1.2 mm

Low maximum seated height allows for a compact and space-saving design, ideal for applications with limited space.

Width: 14 mm

Moderate width provides a balance between space efficiency and ease of handling during installation.

Differential Output: YES

Differential output ensures high signal integrity and noise immunity, making it ideal for high-speed communications.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for quick and efficient reflow soldering process, reducing manufacturing time and cost.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and component bonding for reliable operation.

Length: 14 mm

Moderate length provides a balance between space efficiency and signal integrity, ensuring reliable performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environments with wide temperature variations.

Maximum Receive Delay: 0 ns

Zero receive delay ensures real-time signal transmission, crucial for high-performance applications.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical connection and easy soldering, enhancing overall reliability.

Input Characteristics: DIFFERENTIAL

Differential input characteristics ensure high noise immunity and signal integrity, critical for high-speed data transmission.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage for compatibility with a wide range of systems and applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for compact design and high-density mounting, ideal for space-constrained applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product can withstand standard moisture exposure during manufacturing and operation.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type enables bidirectional signal transmission with conversion between different voltage levels, suitable for communication applications.

Technical Specifications

Line Drivers & Receivers SCAN25100TYA/NOPB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES IN 1.7 TO 1.9 VOLT

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

SCAN25100TYA/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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