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SCAN162602SM

Texas Instruments

SCAN162602SM by Texas Instruments

The Texas Instruments SCAN162602SM is a Line Transceiver with 16-bit driver and receiver functions. It operates b/w -40 to 85°C, with supply voltage range of 2.7-3.6V. Ideal for industrial applications requiring IEEE 1149.1 interface standard and low profile grid array package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,510 parts In-Stock

1+ parts

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4,510

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Digiode

USA . 1,344 parts In-Stock

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1,344

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Anansix

USA . 654 parts In-Stock

1+ parts

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654

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,714 parts In-Stock

1+ parts

$7.191

100+ parts

-

1k+ parts

$7.699

10k+ parts

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1,714

$7.191

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$7.699

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DigiPath Technology Company

USA . 586 parts In-Stock

1+ parts

$7.918

100+ parts

$7.285

1k+ parts

-

10k+ parts

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586

$7.918

$7.285

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ChromeModa Solutions

Germany . 5,560 parts In-Stock

1+ parts

$8.080

100+ parts

$6.626

1k+ parts

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10k+ parts

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5,560

$8.080

$6.626

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IDEA Electronic Components Group

UK . 2,116 parts In-Stock

1+ parts

$8.080

100+ parts

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1k+ parts

$7.272

10k+ parts

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2,116

$8.080

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$7.272

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AZTECH Wire

Italy . 597 parts In-Stock

1+ parts

$15.577

100+ parts

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597

$15.577

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One Stop Electronics

USA . 811 parts In-Stock

1+ parts

$49.500

100+ parts

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811

$49.500

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Corphita

USA . 3,245 parts In-Stock

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3,245

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Overview

Enhance your electronic designs with the SCAN162602SM from Texas Instruments, a leading manufacturer in the industry. Ideal for line drivers and receivers applications, this product offers high-quality performance and reliability. With 16 functions packed into a compact square package, you can trust this device to deliver seamless communication with a maximum supply voltage of 3.6 V. Enjoy the benefits of quick transmit and receive delays, along with industrial-grade temperature tolerance. Upgrade your projects with the value and precision of the SCAN162602SM today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Ability to handle high supply voltage levels makes this product suitable for a wide range of applications.

No. of Functions: 16

With 16 functions, this product offers versatile capabilities for various communication and signal processing tasks.

Package Shape: SQUARE

Square package shape helps in optimizing space on the circuit board, making efficient use of layout design.

Maximum Transmit Delay: 6 ns

Low transmit delay ensures quick and efficient signal transmission, minimizing latency in data transfer.

No. of Terminals: 64

High number of terminals allow for connectivity with multiple external devices, enhancing system integration capabilities.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact and efficient design, suitable for space-constrained applications.

Minimum Supply Voltage: 2.7 V

Ability to operate at low supply voltages makes this product energy efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range allows for use in extreme cold environments without compromising functionality.

Terminal Finish: Tin/Lead (Sn63Pb37)

Tin/Lead terminal finish provides good solderability and conductivity for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and installation on the circuit board.

Maximum Seated Height: 1.5 mm

Low seated height allows for a slim profile design, ideal for applications with height restrictions.

Width: 8 mm

Compact width dimension enables space-saving layout design and efficient use of circuit board real estate.

Receiver No. of Bits: 16

With 16 receiver bits, this product can process and interpret a wide range of data signals for accurate communication.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds ensures proper soldering and component bonding during manufacturing process.

Peak Reflow Temperature °C: 235

High peak reflow temperature tolerance allows for reliable soldering and thermal stability under demanding conditions.

Length: 8 mm

Compact length dimension contributes to a space-efficient design and easy integration into electronic systems.

Temperature Grade: INDUSTRIAL

Industrial temperature grade makes this product suitable for rugged and harsh operating environments.

Maximum Receive Delay: 6 ns

Low receive delay ensures fast processing of incoming signals, reducing latency in data reception.

Terminal Form: BALL

Ball terminal form offers better mechanical strength and secure connections during installation and operation.

Interface Standard: IEEE 1149.1

Compliance with IEEE 1149.1 standard ensures compatibility and interoperability with other industry-standard devices.

Input Characteristics: STANDARD

Standard input characteristics allow for seamless integration with various systems and communication protocols.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage of 3V ensures consistent performance and reliable operation in different power supply conditions.

Terminal Pitch: 0.8 mm

Compact terminal pitch of 0.8mm enables high-density mounting and space-saving on the circuit board.

Driver No. of Bits: 16

Having 16 driver bits provides the product with the capability to accurately transmit and modulate data signals for effective communication.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the product's ability to resist moisture-related damage during storage, handling, and operation.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this product offers bidirectional data transmission capability, making it suitable for various communication applications.

Technical Specifications

Line Drivers & Receivers SCAN162602SM attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

16

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

IEEE 1149.1

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e0

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

16

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Receive Delay:

6 ns

Receiver No. of Bits:

16

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn63Pb37)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

6 ns

Width:

8 mm

Trade Compliance

SCAN162602SM Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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