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SCAN15MB200TSQ

Texas Instruments

SCAN15MB200TSQ by Texas Instruments

The Texas Instruments SCAN15MB200TSQ is a Line Transceiver with 2 functions, CMOS technology, and 48 terminals. It operates at temperatures from -40 to 85°C and has a max supply voltage of 3.6V. Ideal for industrial applications requiring differential output and Schmitt trigger input characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,157 parts In-Stock

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Anansix

USA . 2,743 parts In-Stock

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Digiode

USA . 1,523 parts In-Stock

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1,523

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Distributors (Availability)

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One Stop Electronics

USA . 1,026 parts In-Stock

1+ parts

$5.500

100+ parts

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$5.500

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Parana Technologies

USA . 1,763 parts In-Stock

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$9.081

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$9.739

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$9.081

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$9.739

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DigiPath Technology Company

USA . 522 parts In-Stock

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$9.999

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522

$9.999

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IDEA Electronic Components Group

UK . 2,050 parts In-Stock

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$10.203

100+ parts

$9.693

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$9.183

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2,050

$10.203

$9.693

$9.183

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ChromeModa Solutions

Germany . 1,121 parts In-Stock

1+ parts

$10.203

100+ parts

$8.366

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1,121

$10.203

$8.366

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AZTECH Wire

Italy . 558 parts In-Stock

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$17.418

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Microchip USA

USA . 2,927 parts In-Stock

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Corphita

USA . 2,531 parts In-Stock

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Overview

Experience high-quality performance with the SCAN15MB200TSQ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional line drivers & receivers that are perfect for a wide range of applications. With its superior design and reliability, this product offers customers unparalleled value and benefits. Enhance your systems with the advantages of the SCAN15MB200TSQ and enjoy seamless operation and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the internal components of the product.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and facilitating production processes.

Maximum Supply Voltage: 3.6 V

Can handle high supply voltages, making it suitable for a variety of applications.

No. of Functions: 2

Having multiple functions in one package increases efficiency and saves space on the PCB.

Package Shape: SQUARE

Square shape allows for easier placement and alignment on the PCB.

Maximum Transmit Delay: 2.5 ns

Low transmit delay ensures fast and reliable data transmission.

Power Supplies (V): 3.3

Compatible with standard power supply voltages, making integration easier.

No. of Terminals: 48

Sufficient number of terminals for versatile connectivity options.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles provide flexibility for different mounting and cooling options.

Minimum Supply Voltage: 3 V

Can operate with low supply voltages, saving energy and providing flexibility.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures without performance degradation.

Terminal Position: QUAD

Quad terminal position allows for stable connections and ease of soldering.

Maximum Seated Height: 0.8 mm

Low seated height saves space in compact electronic designs.

Width: 7 mm

Compact width allows for efficient use of PCB real estate.

Differential Output: YES

Differential output helps reduce noise and improves signal integrity.

Length: 7 mm

Compact length complements the width, providing a small footprint overall.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments where temperature fluctuations are common.

Maximum Receive Delay: 2.5 ns

Low receive delay ensures quick processing of incoming data signals.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: NO LEAD

Lead-free terminals are environmentally friendly and compliant with RoHS regulations.

Maximum Supply Current: 275 mA

Can handle relatively high supply currents for robust performance.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger inputs provide hysteresis for noise immunity and signal conditioning.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent operation.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for compact layout on the PCB.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC enables bidirectional communication between different systems or devices.

Technical Specifications

Line Drivers & Receivers SCAN15MB200TSQ attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQCC-N48

Length:

7 mm

No. of Functions:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

2.5 ns

Receiver No. of Bits:

1

Maximum Seated Height:

.8 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

275 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

2.5 ns

Width:

7 mm

Trade Compliance

SCAN15MB200TSQ Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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