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SCAN15MB200TSQX

Texas Instruments

SCAN15MB200TSQX by Texas Instruments

The Texas Instruments SCAN15MB200TSQX is a Line Driver & Receiver with 2 functions, operating at 3.3V. It features a max transmit delay of 2.5ns and differential output for industrial applications requiring high-speed data transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,520 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,520

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Anansix

USA . 2,215 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,215

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Digiode

USA . 1,587 parts In-Stock

1+ parts

-

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1,587

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 425 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

-

10k+ parts

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425

$0.500

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AZTECH Wire

Italy . 540 parts In-Stock

1+ parts

$8.212

100+ parts

-

1k+ parts

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10k+ parts

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540

$8.212

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Parana Technologies

USA . 2,246 parts In-Stock

1+ parts

$11.363

100+ parts

$1,055.193

1k+ parts

$10.226

10k+ parts

-

2,246

$11.363

$1,055.193

$10.226

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DigiPath Technology Company

USA . 516 parts In-Stock

1+ parts

$12.512

100+ parts

-

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10k+ parts

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516

$12.512

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ChromeModa Solutions

Germany . 5,700 parts In-Stock

1+ parts

$12.767

100+ parts

$10.469

1k+ parts

-

10k+ parts

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5,700

$12.767

$10.469

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IDEA Electronic Components Group

UK . 59 parts In-Stock

1+ parts

$12.767

100+ parts

$12.129

1k+ parts

$11.490

10k+ parts

-

59

$12.767

$12.129

$11.490

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Microchip USA

USA . 7,525 parts In-Stock

1+ parts

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100+ parts

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7,525

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Corphita

USA . 757 parts In-Stock

1+ parts

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757

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Kepictronics

USA . 210 parts In-Stock

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210

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Overview

Enhance the performance of your electronic devices with the Texas Instruments SCAN15MB200TSQX Line Driver & Receiver. Crafted with precision by a renowned manufacturer, this product ensures top-notch quality and reliability. Ideal for a wide range of applications in industries such as telecommunications and automotive, this line driver offers efficient data transmission and reception. Experience seamless connectivity and improved functionality with this advanced technology, providing you with the value and benefits you need to stay ahead in today's competitive market. Elevate your projects with the SCAN15MB200TSQX and unlock endless possibilities for innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, making it versatile for a variety of applications.

Package Shape: SQUARE

Compact shape that fits well on circuit boards, optimizing space usage.

Minimum Operating Temperature: -40 °C

Operational in extreme cold conditions, suitable for a wide range of environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Line Drivers & Receivers SCAN15MB200TSQX attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQCC-N48

Length:

7 mm

No. of Functions:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

2.5 ns

Receiver No. of Bits:

1

Maximum Seated Height:

.8 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

275 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

2.5 ns

Width:

7 mm

Trade Compliance

SCAN15MB200TSQX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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