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RM48L730ZWTT

Texas Instruments

RM48L730ZWTT by Texas Instruments

The Texas Instruments RM48L730ZWTT microcontroller features a 32-bit Cortex-R4F CPU, 262144 bytes of RAM, and 2097152 ROM words. With a max clock frequency of 80 MHz, it is ideal for industrial applications requiring high-speed processing and advanced control capabilities. The microcontroller also offers ADC and DMA channels for efficient data acquisition and transfer.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,475 parts In-Stock

1+ parts

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4,475

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Vyrian

USA . 4,111 parts In-Stock

1+ parts

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4,111

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 698 parts In-Stock

1+ parts

$7.092

100+ parts

-

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698

$7.092

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One Stop Electronics

USA . 285 parts In-Stock

1+ parts

$12.000

100+ parts

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285

$12.000

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Parana Technologies

USA . 419 parts In-Stock

1+ parts

$20.639

100+ parts

-

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$20.744

10k+ parts

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419

$20.639

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$20.744

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ChromeModa Solutions

Germany . 5,206 parts In-Stock

1+ parts

$23.190

100+ parts

$19.016

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5,206

$23.190

$19.016

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IDEA Electronic Components Group

UK . 2,168 parts In-Stock

1+ parts

$23.190

100+ parts

$22.030

1k+ parts

$20.871

10k+ parts

-

2,168

$23.190

$22.030

$20.871

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QUARKTWIN TECHNOLOGY LTD

USA . 27,918 parts In-Stock

1+ parts

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27,918

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Corphita

USA . 1,481 parts In-Stock

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1,481

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DigiPath Technology Company

USA . 741 parts In-Stock

1+ parts

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$20.908

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741

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$20.908

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Microchip USA

USA . 450 parts In-Stock

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450

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Overview

Unlock innovation and unleash the power of cutting-edge technology with the RM48L730ZWTT microcontroller from Texas Instruments. Crafted with precision and expertise, this microcontroller offers unparalleled performance and reliability for a wide range of applications. Whether you're designing automotive systems, industrial controls, or consumer electronics, this versatile microcontroller provides unmatched value, efficiency, and functionality. Trust Texas Instruments to deliver top-quality solutions that drive your projects forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy assembly onto PCBs, saving space and reducing overall manufacturing costs.

Maximum Supply Voltage: 1.32 V

A high maximum supply voltage ensures stability and allows for versatile power supply options.

Package Shape: SQUARE

Square package shape is space-efficient and facilitates easy placement on circuit boards.

Bit Size: 32

A 32-bit architecture provides high processing power and efficiency, suitable for a wide range of applications.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages enables flexibility in system design and compatibility with different power sources.

No. of Terminals: 337

Having a large number of terminals allows for connectivity to various external components and peripherals, enhancing the product's functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style provides high density integration, low profile design for space-constrained applications, and precise interconnection pitch for efficiency in PCB layout.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage ensures energy efficiency and extends battery life in portable devices.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, making it suitable for industrial applications.

CPU Family: CORTEX-R4F

Based on the Cortex-R4F architecture, the product offers high performance, real-time processing capabilities, and strong reliability for critical applications.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature ensures operation in extreme cold conditions, making the product suitable for a wide range of environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity, corrosion resistance, and solderability, ensuring reliable electrical connections.

ADC Channels: YES

Analog-to-digital converter channels enable the product to interface with analog sensors and signals, expanding its application capabilities.

DMA Channels: YES

Direct Memory Access channels improve data transfer speeds and reduce CPU overhead, enhancing overall system performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, making it easier to integrate the product into electronic systems.

ROM Words: 2097152

A large ROM capacity allows for storing a significant amount of program data, offering ample space for firmware and application code.

Maximum Seated Height: 1.4 mm

Low maximum seated height enables slim and compact device designs, ideal for space-constrained applications.

Width: 16 mm

A compact width makes the product suitable for small form factor devices without sacrificing performance capabilities.

Maximum Clock Frequency: 80 MHz

High clock frequency enables fast data processing and response times, making the product efficient for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a short reflow time, the product withstands the reflow soldering process efficiently, ensuring reliable solder joints.

Peak Reflow Temperature °C: 260

The high peak reflow temperature makes the product suitable for lead-free soldering processes, complying with environmental regulations.

Length: 16 mm

Compact length allows for space-efficient placement on PCBs, accommodating small device designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environments, making the product suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with RISC architecture provides efficient data processing, low power consumption, and versatile peripheral connectivity options.

RAM Bytes: 262144

A large RAM capacity allows for efficient data storage and processing, enhancing the product's performance in multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, making the product energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form enables reliable solder joints, easy PCB mounting, and efficient heat dissipation, ensuring stable electrical connections.

Nominal Supply Voltage: 1.2 V

A stable nominal supply voltage ensures consistent performance and compatibility with common power sources, simplifying system integration.

PWM Channels: YES

Pulse-width modulation channels enable precise control of analog output signals, making the product suitable for applications requiring accurate voltage or current regulation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates, configuration modifications, and quick development cycles, enhancing product flexibility and adaptability.

Terminal Pitch: 0.8 mm

A fine terminal pitch provides high interconnection density, enabling compact PCB layouts and efficient use of space in electronic designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates the product's resistance to moisture damage during storage, handling, and reflow processes, ensuring long-term reliability.

Speed: 200 rpm

Operating at a speed of 200 rpm, the product offers fast data processing and response times, suitable for applications requiring quick data handling.

No. of I/O Lines: 16

Having 16 I/O lines allows for versatile connectivity to external devices and peripherals, enhancing the product's functionality and compatibility with diverse interfaces.

Technical Specifications

Microcontrollers RM48L730ZWTT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQURIES AT 3.3 V I/O SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

16

No. of Terminals:

337

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

200 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

RM48L730ZWTT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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