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PT7742N

Texas Instruments

PT7742N by Texas Instruments

PT7742N by Texas Instruments is a DC-DC booster module with 27 terminals in a rectangular package. It operates at an input voltage range of 3.1V to 3.6V, making it ideal for applications requiring a nominal input voltage of 3.3V, such as power supply modules in microelectronic assemblies.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,305 parts In-Stock

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8,305

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Digiode

USA . 4,690 parts In-Stock

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4,690

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 215 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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215

$0.500

$0.488

$0.485

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One Stop Electronics

USA . 1,443 parts In-Stock

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$2.500

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1,443

$2.500

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Ampacity Inc.

Singapore . 1,333 parts In-Stock

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$4.500

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$4.500

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AZTECH Wire

Italy . 351 parts In-Stock

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$7.694

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351

$7.694

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Parana Technologies

USA . 1,190 parts In-Stock

1+ parts

$7.780

100+ parts

$722.526

1k+ parts

$7.002

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1,190

$7.780

$722.526

$7.002

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DigiPath Technology Company

USA . 1,819 parts In-Stock

1+ parts

$8.567

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1,819

$8.567

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ChromeModa Solutions

Germany . 6,808 parts In-Stock

1+ parts

$8.742

100+ parts

$7.168

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6,808

$8.742

$7.168

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IDEA Electronic Components Group

UK . 92 parts In-Stock

1+ parts

$8.742

100+ parts

$8.305

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$7.868

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92

$8.742

$8.305

$7.868

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Corphita

USA . 1,301 parts In-Stock

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1,301

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Corohmni

South Africa . 232 parts In-Stock

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Overview

Elevate your power supply game with the PT7742N by Texas Instruments. Known for their unparalleled quality and innovation, Texas Instruments has crafted a power supply module that exceeds expectations. Ideal for a wide range of applications, this DC-DC booster module offers customers reliable performance and efficiency. Say goodbye to power interruptions and hello to seamless operation with the PT7742N. Experience the value and benefits of Texas Instruments technology at its best.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various layouts and designs.

No. of Terminals: 27

Having 27 terminals provides versatility in connection options and compatibility with different systems.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly style ensures precision and reliability in performance.

Terminal Position: SINGLE

Single terminal position simplifies installation and reduces potential points of failure.

Other IC type: DC-DC BOOSTER MODULE

DC-DC booster module ensures efficient power conversion and delivery.

Nominal Input Voltage: 3.3 V

Stable nominal input voltage of 3.3V ensures consistent power supply to connected devices.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections for long-term use.

Minimum Input Voltage: 3.1 V

Low minimum input voltage of 3.1V allows for operation even in low power scenarios.

Maximum Input Voltage: 3.6 V

Maximum input voltage of 3.6V protects against overvoltage situations, ensuring the safety of connected devices.

Technical Specifications

Power Supply Modules PT7742N attributes and parameters. Explore more Power Supply Modules devices from Texas Instruments

Specs

Other IC type:

Maximum Input Voltage:

3.6 V

Minimum Input Voltage:

3.1 V

Nominal Input Voltage:

3.3 V

JESD-30 Code:

R-XSMA-T27

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

27

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Trim or Adjustable Output (V):

NO

Trade Compliance

PT7742N Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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