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PT7740N

Texas Instruments

PT7740N by Texas Instruments

PT7740N by Texas Instruments is a DC-DC booster module with 27 terminals in a rectangular package. It operates on hybrid technology with an input voltage range of 3.1V to 3.6V, suitable for various power supply applications requiring efficient voltage boosting in microelectronic assemblies.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,867 parts In-Stock

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4,867

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Vyrian

USA . 4,837 parts In-Stock

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4,837

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Distributors (Availability)

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One Stop Electronics

USA . 1,476 parts In-Stock

1+ parts

$2.500

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1,476

$2.500

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Ampacity Inc.

Singapore . 1,400 parts In-Stock

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$2.500

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1,400

$2.500

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Semicontronic

India . 911 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

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911

$5.500

$5.362

$5.335

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AZTECH Wire

Italy . 898 parts In-Stock

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$6.365

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898

$6.365

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Parana Technologies

USA . 493 parts In-Stock

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$7.811

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$8.361

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493

$7.811

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$8.361

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DigiPath Technology Company

USA . 170 parts In-Stock

1+ parts

$8.600

100+ parts

$7.912

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170

$8.600

$7.912

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ChromeModa Solutions

Germany . 5,830 parts In-Stock

1+ parts

$8.776

100+ parts

$7.196

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5,830

$8.776

$7.196

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IDEA Electronic Components Group

UK . 770 parts In-Stock

1+ parts

$8.776

100+ parts

$8.337

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$7.898

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770

$8.776

$8.337

$7.898

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Corphita

USA . 3,610 parts In-Stock

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3,610

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Corohmni

South Africa . 257 parts In-Stock

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257

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Overview

Elevate your power supply game with the PT7740N by Texas Instruments. Known for their superior quality and innovation, Texas Instruments delivers top-notch Power Supply Modules that are reliable and efficient. The PT7740N is a game-changer in its category, offering seamless integration and optimal performance. Whether you're powering up your latest project or upgrading your existing system, this DC-DC booster module provides the value, benefits, and advantages that customers like you seek. Say goodbye to power supply woes and hello to a world of endless possibilities with the PT7740N.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic devices and systems.

No. of Terminals: 27

More terminals provide flexibility in connecting to other components and peripherals.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly ensures high precision and reliability in performance.

Terminal Position: SINGLE

Single terminal position simplifies installation and reduces chances of errors in connections.

Other IC type: DC-DC BOOSTER MODULE

DC-DC booster module offers efficient power conversion for optimal performance.

Technology: HYBRID

Hybrid technology combines the benefits of different technologies for enhanced performance and reliability.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and durability in various operating conditions.

Minimum Input Voltage: 3.1 V

Low minimum input voltage allows for compatibility with a wide range of power sources.

Maximum Input Voltage: 3.6 V

Moderate maximum input voltage ensures safe operation and protection of the device.

Technical Specifications

Power Supply Modules PT7740N attributes and parameters. Explore more Power Supply Modules devices from Texas Instruments

Specs

Other IC type:

Maximum Input Voltage:

3.6 V

Minimum Input Voltage:

3.1 V

JESD-30 Code:

R-XSMA-T27

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

27

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Surface Mount:

NO

Technology:

HYBRID

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Trim or Adjustable Output (V):

NO

Trade Compliance

PT7740N Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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