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PT7745C

Texas Instruments

PT7745C by Texas Instruments

PT7745C by Texas Instruments is a voltage-mode DC-DC booster module with 27 terminals, operating b/w -40 to 85°C. It offers a max output current of 20A at a switching frequency of 400 kHz, suitable for industrial applications requiring a nominal input voltage of 5V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,928 parts In-Stock

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Digiode

USA . 4,798 parts In-Stock

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4,798

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Ampacity Inc.

Singapore . 550 parts In-Stock

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$0.500

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550

$0.500

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One Stop Electronics

USA . 343 parts In-Stock

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$0.500

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343

$0.500

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Semicontronic

India . 1,314 parts In-Stock

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$2.500

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$2.438

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$2.425

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$2.500

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AZTECH Wire

Italy . 324 parts In-Stock

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$6.217

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324

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Parana Technologies

USA . 910 parts In-Stock

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$14.837

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$15.268

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910

$14.837

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DigiPath Technology Company

USA . 1,361 parts In-Stock

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$16.338

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$16.338

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IDEA Electronic Components Group

UK . 1,681 parts In-Stock

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$16.671

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$15.837

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$15.004

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1,681

$16.671

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$15.004

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ChromeModa Solutions

Germany . 702 parts In-Stock

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$16.671

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$13.670

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702

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Corphita

USA . 4,213 parts In-Stock

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Corohmni

South Africa . 455 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the PT7745C Power Supply Module. Perfect for industrial applications, this surface-mount module offers a maximum output current of 20A and a wide operating temperature range. With its voltage-mode control and hybrid technology, this DC-DC booster module provides efficient power conversion. Trust in Texas Instruments to deliver cutting-edge solutions for your power supply needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB assembly, making this power supply module easy to integrate into electronic devices.

Package Shape: RECTANGULAR

Rectangular package shape provides a standardized form factor for easy mounting and compatibility with various applications.

No. of Terminals: 27

The high number of terminals allows for versatile connectivity options, enabling the module to cater to a wide range of input and output requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments where temperature fluctuations are common.

Control Mode: VOLTAGE-MODE

Voltage-mode control offers precise regulation of output voltage, ensuring stable and accurate power delivery to connected components.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly package style enhances reliability and durability, making the module suitable for industrial applications where robustness is essential.

Nominal Input Voltage: 5 V

The nominal input voltage of 5 V makes this module compatible with standard power sources, simplifying integration into existing systems.

Maximum Output Current: 20 A

The high maximum output current of 20 A enables the module to power multiple components or devices simultaneously, enhancing its versatility and usability.

Technology: HYBRID

Hybrid technology combines the efficiency of different power conversion techniques, resulting in improved performance and energy efficiency of the module.

Technical Specifications

Power Supply Modules PT7745C attributes and parameters. Explore more Power Supply Modules devices from Texas Instruments

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

5 V

JESD-30 Code:

R-XSMA-G27

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

27

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

20 A

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

SMSIP27H,1.4

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

400 kHz

Technology:

HYBRID

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trim or Adjustable Output (V):

NO

Trade Compliance

PT7745C Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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