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PT7742C

Texas Instruments

PT7742C by Texas Instruments

PT7742C by Texas Instruments is a DC-DC booster module with 27 terminals, suitable for surface mount applications. It operates at an input voltage range of 3.1V to 3.6V, making it ideal for microelectronic assemblies requiring a nominal input voltage of 3.3V. The package style is rectangular with gull wing terminals, ensuring efficient power supply in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,962 parts In-Stock

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Vyrian

USA . 2,353 parts In-Stock

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2,353

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 645 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

10k+ parts

-

645

$3.500

$3.412

$3.395

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One Stop Electronics

USA . 477 parts In-Stock

1+ parts

$6.500

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477

$6.500

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Ampacity Inc.

Singapore . 592 parts In-Stock

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$7.500

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592

$7.500

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AZTECH Wire

Italy . 661 parts In-Stock

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$10.519

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661

$10.519

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Parana Technologies

USA . 171 parts In-Stock

1+ parts

$21.633

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$22.042

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171

$21.633

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$22.042

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ChromeModa Solutions

Germany . 505 parts In-Stock

1+ parts

$24.307

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$19.932

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505

$24.307

$19.932

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IDEA Electronic Components Group

UK . 341 parts In-Stock

1+ parts

$24.307

100+ parts

$23.092

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$21.876

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341

$24.307

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$21.876

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Corphita

USA . 4,233 parts In-Stock

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DigiPath Technology Company

USA . 2,127 parts In-Stock

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$21.915

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$21.915

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Corohmni

South Africa . 447 parts In-Stock

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Overview

Boost your power supply with the PT7742C by Texas Instruments. Known for their top-quality manufacturing, Texas Instruments delivers reliable products that exceed expectations. The PT7742C is a versatile DC-DC booster module with 27 terminals in a convenient rectangular package. Perfect for a wide range of applications, this microelectronic assembly offers a nominal input voltage of 3.3V and a minimum input voltage of 3.1V. Experience the value and benefits of Texas Instruments' PT7742C for all your power supply needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and convenient installation onto circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular package shape enables efficient placement on circuit boards and facilitates optimal use of available space.

No. of Terminals: 27

High number of terminals provide multiple connection points, enabling versatile integration into various electronic systems.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly package style ensures reliable performance and protection for the power supply module.

Terminal Position: SINGLE

Single terminal position simplifies wiring and connection processes, enhancing the overall usability of the module.

IC type: DC-DC BOOSTER MODULE

DC-DC booster module type offers efficient and regulated power conversion, ideal for applications requiring stable voltage output.

Nominal Input Voltage: 3.3 V

Nominal input voltage of 3.3 V provides compatibility with a wide range of electronic devices and systems that operate on similar voltage levels.

Terminal Form: GULL WING

Gull wing terminal form ensures secure and reliable connections, minimizing the risk of electrical faults or interruptions.

Minimum Input Voltage: 3.1 V

Minimum input voltage of 3.1 V allows for operation in low voltage conditions, increasing the flexibility of the module in various power supply applications.

Maximum Input Voltage: 3.6 V

Maximum input voltage of 3.6 V ensures protection against voltage spikes or fluctuations, enhancing the durability and stability of the power supply module.

Technical Specifications

Power Supply Modules PT7742C attributes and parameters. Explore more Power Supply Modules devices from Texas Instruments

Specs

Other IC type:

Maximum Input Voltage:

3.6 V

Minimum Input Voltage:

3.1 V

Nominal Input Voltage:

3.3 V

JESD-30 Code:

R-XSMA-G27

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

27

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Trim or Adjustable Output (V):

NO

Trade Compliance

PT7742C Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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