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PT7743C

Texas Instruments

PT7743C by Texas Instruments

PT7743C by Texas Instruments is a DC-DC booster module with 27 terminals in a rectangular microelectronic assembly package. It operates at an input voltage range of 4.5V to 5.5V, making it ideal for power supply applications requiring a nominal input voltage of 5V. The surface-mount design and gull wing terminal form enhance its versatility for various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,668 parts In-Stock

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4,668

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Vyrian

USA . 2,344 parts In-Stock

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2,344

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,107 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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-

1,107

$0.500

$0.488

$0.485

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One Stop Electronics

USA . 1,283 parts In-Stock

1+ parts

$1.500

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1,283

$1.500

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Ampacity Inc.

Singapore . 1,086 parts In-Stock

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$1.500

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1,086

$1.500

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Parana Technologies

USA . 2,015 parts In-Stock

1+ parts

$7.361

100+ parts

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$7.855

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2,015

$7.361

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$7.855

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ChromeModa Solutions

Germany . 5,543 parts In-Stock

1+ parts

$8.271

100+ parts

$6.782

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5,543

$8.271

$6.782

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IDEA Electronic Components Group

UK . 2,299 parts In-Stock

1+ parts

$8.271

100+ parts

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1k+ parts

$7.444

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2,299

$8.271

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$7.444

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AZTECH Wire

Italy . 616 parts In-Stock

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$11.712

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616

$11.712

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Corphita

USA . 3,087 parts In-Stock

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3,087

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DigiPath Technology Company

USA . 1,631 parts In-Stock

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$7.457

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1,631

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$7.457

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Corohmni

South Africa . 187 parts In-Stock

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187

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Overview

Upgrade your power supply with the PT7743C by Texas Instruments, a top-quality DC-DC booster module designed for efficiency and reliability. Manufactured by industry leader Texas Instruments, this surface-mount module offers 27 terminals in a compact rectangular package shape, making it ideal for a variety of applications. With a nominal input voltage of 5V and a minimum input voltage of 4.5V, the PT7743C provides customers with excellent performance and value. Trust Texas Instruments for all your power supply needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact and efficient assembly, making this power supply module suitable for smaller electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor for easy integration into various electronic applications.

No. of Terminals: 27

Having 27 terminals allows for multiple connections, supporting various input and output configurations for flexibility in design.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style ensures high reliability and stable performance in demanding environments.

Terminal Position: SINGLE

Single terminal position simplifies installation and wiring, reducing complexity and potential errors during assembly.

Other IC type: DC-DC BOOSTER MODULE

The DC-DC booster module provides efficient voltage conversion, ideal for applications requiring higher output voltage levels.

Nominal Input Voltage: 5 V

The 5V nominal input voltage is commonly used in electronics, making this power supply module compatible with a wide range of devices.

Terminal Form: GULL WING

The gull wing terminal form facilitates easier soldering and provides mechanical strength, ensuring reliable connections.

Minimum Input Voltage: 4.5 V

The minimum input voltage of 4.5V allows for operation under lower voltage conditions, increasing the versatility of this power supply module.

Maximum Input Voltage: 5.5 V

The maximum input voltage of 5.5V protects against potential overvoltage situations, enhancing the safety and durability of the module.

Technical Specifications

Power Supply Modules PT7743C attributes and parameters. Explore more Power Supply Modules devices from Texas Instruments

Specs

Other IC type:

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

5 V

JESD-30 Code:

R-XSMA-G27

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

27

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Trim or Adjustable Output (V):

NO

Trade Compliance

PT7743C Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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