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PT7745N

Texas Instruments

PT7745N by Texas Instruments

PT7745N by Texas Instruments is a voltage-mode DC-DC booster module with 27 terminals, operating b/w -40 to 85°C. It offers a max output current of 20A at a switching frequency of 400kHz, suitable for industrial applications requiring a nominal input voltage of 5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,651 parts In-Stock

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1,651

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Vyrian

USA . 1,538 parts In-Stock

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1,538

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Prism Electronics

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 516 parts In-Stock

1+ parts

$0.500

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516

$0.500

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Parana Technologies

USA . 2,335 parts In-Stock

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$5.403

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$6.098

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2,335

$5.403

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$6.098

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DigiPath Technology Company

USA . 692 parts In-Stock

1+ parts

$5.950

100+ parts

$5.474

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692

$5.950

$5.474

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ChromeModa Solutions

Germany . 3,041 parts In-Stock

1+ parts

$6.071

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$4.978

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3,041

$6.071

$4.978

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IDEA Electronic Components Group

UK . 1,850 parts In-Stock

1+ parts

$6.071

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$5.464

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1,850

$6.071

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$5.464

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AZTECH Wire

Italy . 325 parts In-Stock

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$18.607

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325

$18.607

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Corphita

USA . 152 parts In-Stock

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152

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Overview

Experience the power of innovation with the PT7745N by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability in their Power Supply Modules. The PT7745N is designed for industrial applications, offering a wide input voltage range and high output current capability. With a compact and efficient design, this DC-DC booster module provides customers with superior performance and value. Trust Texas Instruments to power your next project with excellence.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and compact design in various electronic devices.

No. of Terminals: 27

Having 27 terminals provides flexibility and compatibility for connecting to different components in a system.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance in industrial environments.

Control Mode: VOLTAGE-MODE

Voltage-mode control offers precise regulation and stability of output voltage, essential for power supply modules.

Nominal Input Voltage: 5 V

Standard nominal input voltage of 5V ensures compatibility with a wide range of electronic devices and systems.

Maximum Output Current: 20 A

High maximum output current of 20A enables powering of devices with higher power requirements.

Technology: HYBRID

Hybrid technology combines the benefits of different power conversion technologies for improved efficiency and performance.

Minimum Input Voltage: 4.5 V

Low minimum input voltage allows for operation even with lower input power sources, increasing flexibility.

Technical Specifications

Power Supply Modules PT7745N attributes and parameters. Explore more Power Supply Modules devices from Texas Instruments

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

5 V

JESD-30 Code:

R-XSMA-T27

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

27

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

20 A

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

SIP27

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

NO

Maximum Switching Frequency:

400 kHz

Technology:

HYBRID

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Trim or Adjustable Output (V):

NO

Trade Compliance

PT7745N Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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