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PCM2900E/2KG4

Texas Instruments

PCM2900E/2KG4 by Texas Instruments

PCM2900E/2KG4 by Texas Instruments is a consumer IC with 28 terminals, operating at 5V. It has a small outline package style and can withstand temperatures from 0 to 70°C. Ideal for applications requiring a compact design and reliable performance in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,750

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-

-

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Digiode

USA . 1,678 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,678

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 259 parts In-Stock

1+ parts

$1.294

100+ parts

-

1k+ parts

$2.048

10k+ parts

-

259

$1.294

-

$2.048

-

DigiPath Technology Company

USA . 2,054 parts In-Stock

1+ parts

$1.425

100+ parts

$1.311

1k+ parts

-

10k+ parts

-

2,054

$1.425

$1.311

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ChromeModa Solutions

Germany . 4,027 parts In-Stock

1+ parts

$1.454

100+ parts

$1.192

1k+ parts

-

10k+ parts

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4,027

$1.454

$1.192

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IDEA Electronic Components Group

UK . 196 parts In-Stock

1+ parts

$1.454

100+ parts

-

1k+ parts

$1.309

10k+ parts

-

196

$1.454

-

$1.309

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AZTECH Wire

Italy . 518 parts In-Stock

1+ parts

$5.283

100+ parts

-

1k+ parts

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10k+ parts

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518

$5.283

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One Stop Electronics

USA . 905 parts In-Stock

1+ parts

$17.800

100+ parts

-

1k+ parts

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905

$17.800

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-

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Microchip USA

USA . 4,416 parts In-Stock

1+ parts

-

100+ parts

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4,416

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Corphita

USA . 2,853 parts In-Stock

1+ parts

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2,853

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Overview

Upgrade your consumer electronics with the PCM2900E/2KG4 by Texas Instruments, a high-quality consumer circuit IC that delivers exceptional performance and reliability. Designed with precision and expertise, this product offers seamless integration, compact design, and excellent functionality for a wide range of applications. Transform your devices with the advanced technology and superior features of the PCM2900E/2KG4, providing unmatched value and benefits to customers seeking top-tier components for their projects. Elevate your products to the next level with this cutting-edge solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material offers good durability and protection for the IC, ensuring a longer lifespan.

Surface Mount: YES

Surface-mount technology allows for easier and more efficient PCB assembly.

Maximum Operating Temperature: 70 °C

Can operate at relatively high temperatures, making it suitable for various environments.

Minimum Operating Temperature: 0 °C

Can operate at lower temperatures, providing versatility in usage scenarios.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Offers excellent conductivity and corrosion resistance for reliable performance.

Width: 5.3 mm

Compact size allows for space-saving integration into electronic devices.

Technical Specifications

Other Function Consumer ICs PCM2900E/2KG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.25V TO 3.5V SUPPLY

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

67 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.35 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

PCM2900E/2KG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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