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PCI2050PDVG4

Texas Instruments

PCI2050PDVG4 by Texas Instruments

PCI2050PDVG4 by Texas Instruments is a bus controller with 32-bit address and external data bus width. It operates at 3-3.6V, supports PCI bus compatibility, and has a max clock frequency of 33MHz. Ideal for commercial applications requiring low profile, fine pitch package style with nickel palladium gold terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,375 parts In-Stock

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7,375

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Digiode

USA . 1,369 parts In-Stock

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1,369

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Bristol Electronics

USA . 3 parts In-Stock

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3

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Distributors (Availability)

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AZTECH Wire

Italy . 291 parts In-Stock

1+ parts

$15.091

100+ parts

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291

$15.091

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One Stop Electronics

USA . 974 parts In-Stock

1+ parts

$23.000

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974

$23.000

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Corohmni

South Africa . 1,193 parts In-Stock

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$52.630

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1,193

$52.630

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Parana Technologies

USA . 1,732 parts In-Stock

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$65.580

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1,732

$65.580

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DigiPath Technology Company

USA . 1,899 parts In-Stock

1+ parts

$72.211

100+ parts

$66.434

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1,899

$72.211

$66.434

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ChromeModa Solutions

Germany . 2,511 parts In-Stock

1+ parts

$73.685

100+ parts

$60.422

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2,511

$73.685

$60.422

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IDEA Electronic Components Group

UK . 930 parts In-Stock

1+ parts

$73.685

100+ parts

$70.001

1k+ parts

$66.316

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930

$73.685

$70.001

$66.316

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Lixinc

USA . 19,851 parts In-Stock

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Corphita

USA . 3,016 parts In-Stock

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3,016

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Microchip USA

USA . 287 parts In-Stock

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287

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Overview

Unlock seamless data communication and enhance system performance with the PCI2050PDVG4 by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability. This bus controller is designed for various applications, offering customers unmatched value and benefits. With a maximum supply voltage of 3.6V and a surface mount feature, this product is versatile and efficient. Upgrade your systems today with the PCI2050PDVG4 and experience unparalleled connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures stable and reliable operation.

Address Bus Width: 32

A wide address bus width allows for efficient data processing and communication.

Package Shape: SQUARE

The square shape helps in easy integration and layout design of the product.

Power Supplies (V): 3.3, 3.3/5

Multiple power supply options offer flexibility in voltage requirements for different applications.

No. of Terminals: 208

A high number of terminals allow for multiple connections and functions to be supported.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package style options provide versatility in fitting the product in various devices and designs.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures power efficiency and compatibility with lower voltage systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliability in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures functionality in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: QUAD

The quad terminal position allows for easy soldering and secure connections.

Maximum Seated Height: 1.45 mm

The low seated height enables compact product design and space-saving installation.

Width: 28 mm

The moderate width allows for easy integration and compatibility with standard board sizes.

External Data Bus Width: 32

A wide external data bus width facilitates fast data transfer and communication between components.

Maximum Clock Frequency: 33 MHz

The high maximum clock frequency ensures quick data processing and responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures safe and effective soldering process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable soldering and strong connections.

Length: 28 mm

The moderate length enables easy placement and layout design of the product.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures compatibility with standard operating environments.

Peripheral IC Type: BUS CONTROLLER, PCI

The bus controller PCI type allows for efficient data management and communication in peripheral devices.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance for enhanced efficiency.

Terminal Form: GULL WING

The gull wing terminal form provides secure soldering and stable connections.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage ensures consistent and reliable power delivery for the product.

Bus Compatibility: PCI

PCI bus compatibility ensures seamless integration and communication with a wide range of devices and systems.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for compact design and efficient use of space on circuit boards.

Technical Specifications

Bus Controllers PCI2050PDVG4 attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

33 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e4

Length:

28 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

208

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Trade Compliance

PCI2050PDVG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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