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PCA9546ADRG4

Texas Instruments

PCA9546ADRG4 by Texas Instruments

PCA9546ADRG4 by Texas Instruments is a bus driver with 2 functions and 4 inputs. It has a propagation delay of 1 ns at nominal voltage of 2.5 V, suitable for bidirectional control applications in industrial settings. The package style is small outline with dimensions of 9.9mm x 3.9mm x 1.75mm, making it ideal for surface mount designs requiring true output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,147 parts In-Stock

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Chip Stock

USA . 6,730 parts In-Stock

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6,730

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Digiode

USA . 1,633 parts In-Stock

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1,633

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Bristol Electronics

USA . 8 parts In-Stock

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8

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One Stop Electronics

USA . 659 parts In-Stock

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$5.000

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659

$5.000

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Andel Nordic

Denmark . 306 parts In-Stock

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$7.958

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$7.640

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$7.640

306

$7.958

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$7.640

$7.640

AZTECH Wire

Italy . 894 parts In-Stock

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$18.821

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894

$18.821

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Parana Technologies

USA . 103 parts In-Stock

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$28.775

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$51.720

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103

$28.775

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$51.720

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DigiPath Technology Company

USA . 1,149 parts In-Stock

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$31.684

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ChromeModa Solutions

Germany . 3,988 parts In-Stock

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$32.331

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$26.511

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$26.511

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IDEA Electronic Components Group

UK . 26 parts In-Stock

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$32.331

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$30.714

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$29.098

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26

$32.331

$30.714

$29.098

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Corphita

USA . 3,882 parts In-Stock

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iodParts Technologies Inc.

India . 550 parts In-Stock

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Overview

Enhance your electronic designs with the high-quality PCA9546ADRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers reliable and innovative solutions for Bus Driver & Transceivers. This versatile product offers customers the value of efficient signal routing, with 4 inputs and 2 functions in a small outline package. Perfect for industrial applications, this device operates seamlessly in a wide temperature range from -40 to 85°C. Trust Texas Instruments to provide exceptional performance and reliability in every design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the bus driver & transceiver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 1 ns

With a fast propagation delay, this product allows for quick signal transmission, making it suitable for high-speed communication applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a standard voltage level of 2.5V, making it compatible with a wide range of electronic systems.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures stable performance and signal integrity within the specified range of operation.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, making it suitable for harsh environments and industrial applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and compatibility with various digital systems, enhancing energy efficiency.

Technical Specifications

Bus Driver & Transceivers PCA9546ADRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

9546

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Ports:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.012 mA

Propagation Delay At Nominal Supply:

1 ns

Propagation Delay (tpd):

1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

3.9 mm

Trade Compliance

PCA9546ADRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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