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PCA9543BPW,118

NXP Semiconductors

PCA9543BPW,118 by NXP Semiconductors

BUS EXCHANGER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$0.988

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,315 parts In-Stock

1+ parts

-

100+ parts

$0.969

1k+ parts

$0.804

10k+ parts

$0.717

1,315

-

$0.969

$0.804

$0.717

Verical

USA . 1,315 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.006

10k+ parts

$0.896

1,315

-

-

$1.006

$0.896

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 176 parts In-Stock

1+ parts

$0.554

100+ parts

$0.582

1k+ parts

$0.549

10k+ parts

-

176

$0.554

$0.582

$0.549

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Digiode

USA . 3,469 parts In-Stock

1+ parts

$0.755

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3,469

$0.755

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Vyrian

USA . 4,780 parts In-Stock

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4,780

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Semi Source

USA . 2,940 parts In-Stock

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2,940

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Anansix

USA . 1,397 parts In-Stock

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1,397

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Odi Ramu Company

Canada . 100 parts In-Stock

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100

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Bristol Electronics

USA . 22 parts In-Stock

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22

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 937 parts In-Stock

1+ parts

$0.716

100+ parts

-

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937

$0.716

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Vigor

Singapore . 71 parts In-Stock

1+ parts

$1.520

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71

$1.520

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Andel Nordic

Denmark . 278 parts In-Stock

1+ parts

$6.438

100+ parts

-

1k+ parts

$6.180

10k+ parts

$6.180

278

$6.438

-

$6.180

$6.180

AZTECH Wire

Italy . 52 parts In-Stock

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$11.570

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52

$11.570

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Microchip USA

USA . 348 parts In-Stock

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$20.596

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348

$20.596

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QUARKTWIN TECHNOLOGY LTD

USA . 15,977 parts In-Stock

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15,977

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UNI Independent Distributors

Spain . 7,775 parts In-Stock

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Perfect Parts

USA . 2,623 parts In-Stock

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2,623

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Technical Specifications

Bus Driver & Transceivers PCA9543BPW,118 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 2.3 TO 3.6 V SUPPLY

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

9543

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR, 13 INCH

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.1 mA

Propagation Delay (tpd):

.3 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

PCA9543BPW,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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