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PCA9546ADGVRG4

Texas Instruments

PCA9546ADGVRG4 by Texas Instruments

PCA9546ADGVRG4 by Texas Instruments is a bus driver with 2 functions and 4 inputs. It has a propagation delay of 1 ns, operates at -40 to 85 °C, and supports up to 5.5 V supply voltage. Ideal for bidirectional control in industrial applications due to its compact size and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,387 parts In-Stock

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Bristol Electronics

USA . 3,975 parts In-Stock

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3,975

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Digiode

USA . 967 parts In-Stock

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967

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Distributors (Availability)

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Andel Nordic

Denmark . 724 parts In-Stock

1+ parts

$2.563

100+ parts

-

1k+ parts

$2.461

10k+ parts

$2.461

724

$2.563

-

$2.461

$2.461

AZTECH Wire

Italy . 497 parts In-Stock

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$17.558

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497

$17.558

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One Stop Electronics

USA . 348 parts In-Stock

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$21.000

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348

$21.000

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Parana Technologies

USA . 1,182 parts In-Stock

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$21.123

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$21.388

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1,182

$21.123

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$21.388

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DigiPath Technology Company

USA . 483 parts In-Stock

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$23.259

100+ parts

$21.399

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483

$23.259

$21.399

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ChromeModa Solutions

Germany . 5,663 parts In-Stock

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$23.734

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$19.462

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$23.734

$19.462

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IDEA Electronic Components Group

UK . 359 parts In-Stock

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$23.734

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$22.547

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$21.361

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359

$23.734

$22.547

$21.361

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Corphita

USA . 2,364 parts In-Stock

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Overview

Enhance your electronic designs with the PCA9546ADGVRG4 by Texas Instruments, a top-tier manufacturer in the industry. This Bus Driver & Transceiver offers unparalleled quality, reliability, and versatility for a wide range of applications. With its advanced technology and innovative features, this product ensures seamless data transmission and efficient signal routing. Experience the benefits of this cutting-edge device, from its high performance to its compact design, making it a valuable addition to any project. Trust Texas Instruments to deliver excellence with the PCA9546ADGVRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body, ensuring the product is sturdy and easy to handle.

Propagation Delay At Nominal Supply: 1 ns

Fast propagation delay ensures quick signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Easily mountable on PCBs, saving space and making installation convenient.

Nominal Supply Voltage: 2.5V

Operates at low voltage, reducing power consumption and compatibility with various systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Technology: CMOS

Utilizes CMOS technology for efficient power consumption and high noise immunity.

Technical Specifications

Bus Driver & Transceivers PCA9546ADGVRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

9546

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Ports:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.012 mA

Propagation Delay At Nominal Supply:

1 ns

Propagation Delay (tpd):

1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

3.6 mm

Trade Compliance

PCA9546ADGVRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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