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O9039A362IZWSRQ1

Texas Instruments

O9039A362IZWSRQ1 by Texas Instruments

Texas Instruments' O9039A362IZWSRQ1 is a Power Management IC with 169 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial applications. With 13 channels and low profile design, it's ideal for power supply management circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,107 parts In-Stock

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Digiode

USA . 3,853 parts In-Stock

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3,853

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Distributors (Availability)

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One Stop Electronics

USA . 895 parts In-Stock

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$1.500

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895

$1.500

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Ampacity Inc.

Singapore . 928 parts In-Stock

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$3.500

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928

$3.500

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Semicontronic

India . 414 parts In-Stock

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$4.500

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$4.388

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$4.365

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414

$4.500

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$4.365

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Parana Technologies

USA . 6 parts In-Stock

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$11.538

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$11.948

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6

$11.538

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$11.948

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DigiPath Technology Company

USA . 565 parts In-Stock

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$12.705

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$11.688

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565

$12.705

$11.688

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AZTECH Wire

Italy . 474 parts In-Stock

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$12.935

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474

$12.935

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ChromeModa Solutions

Germany . 6,967 parts In-Stock

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$12.964

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$10.630

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IDEA Electronic Components Group

UK . 310 parts In-Stock

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$12.964

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$12.316

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$11.668

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310

$12.964

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Corphita

USA . 1,527 parts In-Stock

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Corohmni

South Africa . 187 parts In-Stock

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Overview

Unlock the power of efficient power management with the O9039A362IZWSRQ1 by Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments delivers top-quality Power Management ICs that are perfect for a wide range of applications. This product offers customers unparalleled value and benefits, providing reliable performance in industrial settings with a temperature range from -40°C to 85°C. Say goodbye to power supply issues with this innovative solution that features 13 channels and a terminal pitch of 0.8 mm. Experience peace of mind knowing that Texas Instruments has you covered with their cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the internal components of the Power Management IC.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the IC onto a PCB, saving time and effort.

Package Shape: SQUARE

The square shape of the package enables efficient use of space on the PCB and ensures a compact design.

No. of Terminals: 169

Having a high number of terminals allows for more connections, enabling the IC to perform a wide range of functions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can function effectively even in challenging environmental conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures that the IC can operate in both extreme cold and hot conditions, making it versatile.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity and corrosion resistance, ensuring reliable performance of the IC.

Width (mm): 12 mm

The compact width of the IC allows for efficient use of space on the PCB and helps in creating a sleek design.

Minimum Supply Voltage (Vsup): 3.135 V

The low minimum supply voltage enables the IC to operate efficiently even with limited power supply.

Temperature Grade: INDUSTRIAL

Being industrial-grade means the IC is designed to withstand harsh industrial environments, ensuring reliability and durability.

No. of Channels: 13

Having multiple channels allows the IC to manage and control various power supplies simultaneously, enhancing its versatility.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures that the IC can withstand the soldering process during assembly without damage.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the IC is designed to withstand moderate levels of moisture exposure, making it suitable for a variety of environments.

Maximum Supply Voltage (Vsup): 5.25 V

The high maximum supply voltage allows the IC to handle a wide range of input voltages, making it versatile for different applications.

Technical Specifications

Power Management ICs O9039A362IZWSRQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PBGA-B169

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

13

No. of Functions:

1

No. of Terminals:

169

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

3.135 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

12 mm

Trade Compliance

O9039A362IZWSRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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