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O9039A36BIZWSRQ1

Texas Instruments

O9039A36BIZWSRQ1 by Texas Instruments

Texas Instruments O9039A36BIZWSRQ1 is a Power Management IC with 169 terminals, operating at -40 to 85°C. It features a nominal voltage of 3.8V, AEC-Q100 screening level, and is suitable for industrial applications requiring power supply management circuits in a compact grid array package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,262 parts In-Stock

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8,262

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Digiode

USA . 2,185 parts In-Stock

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2,185

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,234 parts In-Stock

1+ parts

$2.500

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1,234

$2.500

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Semicontronic

India . 1,075 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

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1,075

$4.500

$4.388

$4.365

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Ampacity Inc.

Singapore . 184 parts In-Stock

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$4.500

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184

$4.500

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AZTECH Wire

Italy . 385 parts In-Stock

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$15.679

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385

$15.679

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Parana Technologies

USA . 2,075 parts In-Stock

1+ parts

$20.303

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$20.309

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2,075

$20.303

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$20.309

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DigiPath Technology Company

USA . 39 parts In-Stock

1+ parts

$22.356

100+ parts

$20.567

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39

$22.356

$20.567

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ChromeModa Solutions

Germany . 2,704 parts In-Stock

1+ parts

$22.812

100+ parts

$18.706

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2,704

$22.812

$18.706

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IDEA Electronic Components Group

UK . 1,480 parts In-Stock

1+ parts

$22.812

100+ parts

$21.671

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$20.531

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1,480

$22.812

$21.671

$20.531

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Corphita

USA . 3,120 parts In-Stock

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3,120

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Corohmni

South Africa . 165 parts In-Stock

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Overview

Upgrade your power management system with the high-quality O9039A36BIZWSRQ1 by Texas Instruments. Designed with precision and expertise, this Power Management IC offers unparalleled performance and reliability for various applications. With its advanced features and durable construction, this product ensures optimal functionality and efficiency. Experience seamless operation and enhanced productivity with this cutting-edge solution. Choose Texas Instruments for unmatched quality and superior performance in power management technology. Elevate your systems to new heights with the O9039A36BIZWSRQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a cost-effective and durable packaging solution for the IC.

Surface Mount: YES

Enables easy and efficient PCB assembly process.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance.

Nominal Supply Voltage (Vsup): 3.8 V

Designed to operate efficiently at 3.8 V supply voltage.

No. of Terminals: 169

Provides a high level of connectivity for various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Offers a compact and space-saving design for tight PCB layouts.

Maximum Operating Temperature: 85 °C

Ensures reliable operation even at high temperatures.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance.

Maximum Seated Height: 1.4 mm

Low profile design for space-constrained applications.

Width (mm): 12 mm

Compact size ideal for small form factor devices.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Specifically designed for efficient power management.

Minimum Supply Voltage (Vsup): 3.135 V

Operates reliably at low supply voltages.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient reflow soldering process during assembly.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly.

Length: 12 mm

Compact size suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with wide temperature ranges.

No. of Channels: 18

Provides multiple channels for power supply management.

Terminal Form: BALL

Enables easy and reliable solder ball attachment.

Terminal Pitch: 0.8 mm

Fine pitch terminals for high-density PCB layouts.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture damage during storage and operation.

Maximum Supply Voltage (Vsup): 5.25 V

Capable of handling higher supply voltages for various applications.

Adjustable Threshold: YES

Allows for customization of voltage thresholds for specific application requirements.

Technical Specifications

Power Management ICs O9039A36BIZWSRQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PBGA-B169

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

18

No. of Functions:

1

No. of Terminals:

169

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage (Vsup):

3.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

12 mm

Trade Compliance

O9039A36BIZWSRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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