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O9038A352IZWSRQ1

Texas Instruments

O9038A352IZWSRQ1 by Texas Instruments

Texas Instruments O9038A352IZWSRQ1 is a Power Management IC with 169 terminals, operating at -40 to 85°C. It offers a max output current of 6A, switching frequency of 2700 kHz, and supports industrial temperature grade applications. The IC features a low profile grid array package with fine pitch terminals suitable for power supply management circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,888 parts In-Stock

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3,888

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Digiode

USA . 1,208 parts In-Stock

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1,208

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Chip Stock

USA . 225 parts In-Stock

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225

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Distributors (Availability)

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Ampacity Inc.

Singapore . 267 parts In-Stock

1+ parts

$1.500

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267

$1.500

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Semicontronic

India . 952 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

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$3.395

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-

952

$3.500

$3.412

$3.395

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Parana Technologies

USA . 381 parts In-Stock

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$3.512

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$4.037

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381

$3.512

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$4.037

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ChromeModa Solutions

Germany . 3,285 parts In-Stock

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$3.946

100+ parts

$3.236

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3,285

$3.946

$3.236

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IDEA Electronic Components Group

UK . 166 parts In-Stock

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$3.946

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$3.551

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166

$3.946

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$3.551

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One Stop Electronics

USA . 1,371 parts In-Stock

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$5.500

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1,371

$5.500

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AZTECH Wire

Italy . 533 parts In-Stock

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$18.676

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533

$18.676

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Corphita

USA . 3,434 parts In-Stock

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Microchip USA

USA . 1,825 parts In-Stock

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DigiPath Technology Company

USA . 1,441 parts In-Stock

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$3.558

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$3.558

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Corohmni

South Africa . 420 parts In-Stock

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Overview

Unlock the power of efficient power management with the O9038A352IZWSRQ1 by Texas Instruments. Designed with precision and expertise, this Power Management IC provides reliable performance in a variety of applications. With its high-quality construction and advanced features, it offers customers unmatched value and benefits. Say goodbye to power issues and hello to seamless operation with this top-of-the-line product. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and provides good insulation, making the product reliable and durable.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.8 V

Provides a stable power supply within the specified range, ensuring proper functionality of connected devices.

No. of Terminals: 169

Offers a high level of connectivity options for various components, increasing versatility in power management applications.

Maximum Operating Temperature: 85 °C

Designed to withstand high temperatures, making it suitable for industrial environments with demanding operating conditions.

Terminal Finish: TIN SILVER COPPER

This finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

Maximum Output Voltage: 3.3 V

Delivers a stable and regulated output voltage, protecting connected devices from overvoltage damage.

Width (mm): 12 mm

Compact size allows for space-efficient integration into electronic devices, especially useful in small form factor applications.

Minimum Supply Voltage (Vsup): 3.135 V

Provides a wide input voltage range, allowing for compatibility with various power sources.

Maximum Output Current: 6 A

Capable of delivering high current output, suitable for power-hungry devices and applications.

Technical Specifications

Power Management ICs O9038A352IZWSRQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PBGA-B169

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

18

No. of Functions:

1

No. of Outputs:

18

No. of Terminals:

169

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

6 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage (Vsup):

3.8 V

Surface Mount:

YES

Maximum Switching Frequency:

2700 kHz

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

12 mm

Trade Compliance

O9038A352IZWSRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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