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O9039A360IZWSRQ1

Texas Instruments

O9039A360IZWSRQ1 by Texas Instruments

Texas Instruments O9039A360IZWSRQ1 is a Power Management IC with 169 terminals, suitable for industrial applications. It operates b/w -40 to 85°C, with Vsup ranging from 3.135V to 5.25V. This IC features AEC-Q100 screening and is designed in a low profile grid array package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,491 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,491

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Digiode

USA . 2,835 parts In-Stock

1+ parts

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-

1k+ parts

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2,835

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,167 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

1,167

$1.500

$1.462

$1.455

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One Stop Electronics

USA . 666 parts In-Stock

1+ parts

$1.500

100+ parts

-

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666

$1.500

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Ampacity Inc.

Singapore . 656 parts In-Stock

1+ parts

$6.500

100+ parts

-

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656

$6.500

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Parana Technologies

USA . 1,876 parts In-Stock

1+ parts

$7.659

100+ parts

-

1k+ parts

$8.185

10k+ parts

-

1,876

$7.659

-

$8.185

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DigiPath Technology Company

USA . 2,179 parts In-Stock

1+ parts

$8.434

100+ parts

-

1k+ parts

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10k+ parts

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2,179

$8.434

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ChromeModa Solutions

Germany . 2,043 parts In-Stock

1+ parts

$8.606

100+ parts

$7.057

1k+ parts

-

10k+ parts

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2,043

$8.606

$7.057

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IDEA Electronic Components Group

UK . 1,885 parts In-Stock

1+ parts

$8.606

100+ parts

$8.176

1k+ parts

$7.745

10k+ parts

-

1,885

$8.606

$8.176

$7.745

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AZTECH Wire

Italy . 342 parts In-Stock

1+ parts

$13.831

100+ parts

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342

$13.831

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Corphita

USA . 4,427 parts In-Stock

1+ parts

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4,427

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Corohmni

South Africa . 366 parts In-Stock

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366

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Overview

Experience unparalleled power management with the O9039A360IZWSRQ1 by Texas Instruments, a leader in cutting-edge technology. Designed with precision and innovation, this Power Management IC is ideal for a wide range of applications. From industrial settings to automotive environments, this product offers unmatched reliability and efficiency. Say goodbye to power supply issues and hello to seamless performance with the O9039A360IZWSRQ1. Upgrade your systems today and witness the difference that Texas Instruments can make in your operations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and helps protect the IC from external elements, ensuring the product's longevity.

Surface Mount: YES

Facilitates easy and secure mounting of the IC on PCBs, saving time during assembly.

Nominal Supply Voltage (Vsup): 3.8 V

Optimal supply voltage for efficient power management and performance of the IC.

No. of Terminals: 169

Sufficient number of terminals for connecting various components, enhancing versatility and functionality.

Maximum Operating Temperature: 85 °C

Can operate efficiently even under high temperature conditions, offering reliability in diverse environments.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance for stable connections and long-term usage.

Width (mm): 12 mm

Compact size enables easy integration into different systems without taking up too much space.

No. of Channels: 18

Multiple channels allow for simultaneous power management, enhancing overall performance and efficiency.

Adjustable Threshold: YES

Ability to adjust thresholds allows for customization based on specific requirements, making the IC adaptable to different applications.

Technical Specifications

Power Management ICs O9039A360IZWSRQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PBGA-B169

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

18

No. of Functions:

1

No. of Terminals:

169

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage (Vsup):

3.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

12 mm

Trade Compliance

O9039A360IZWSRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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