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LP8552TLE-E01/NOPB

Texas Instruments

LP8552TLE-E01/NOPB by Texas Instruments

LP8552TLE-E01/NOPB by Texas Instruments is a graphics display driver with 12 segments. It operates b/w -30 to 85 °C and has a supply voltage range of 5.5V to 22V. With a serial data input mode, it is ideal for LED display driver applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,664 parts In-Stock

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7,664

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Digiode

USA . 1,390 parts In-Stock

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1,390

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,855 parts In-Stock

1+ parts

$12.027

100+ parts

-

1k+ parts

$12.433

10k+ parts

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1,855

$12.027

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$12.433

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AZTECH Wire

Italy . 260 parts In-Stock

1+ parts

$12.931

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260

$12.931

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DigiPath Technology Company

USA . 1,586 parts In-Stock

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$13.244

100+ parts

$12.184

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1,586

$13.244

$12.184

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ChromeModa Solutions

Germany . 868 parts In-Stock

1+ parts

$13.514

100+ parts

$11.081

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868

$13.514

$11.081

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IDEA Electronic Components Group

UK . 204 parts In-Stock

1+ parts

$13.514

100+ parts

$12.838

1k+ parts

$12.163

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204

$13.514

$12.838

$12.163

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One Stop Electronics

USA . 312 parts In-Stock

1+ parts

$19.500

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312

$19.500

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Corphita

USA . 3,695 parts In-Stock

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3,695

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Microchip USA

USA . 1,497 parts In-Stock

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Overview

Enhance your display experience with the LP8552TLE-E01/NOPB by Texas Instruments. This Graphics Display Driver is designed with precision and quality in mind, offering a seamless data input mode via serial connection. Ideal for various applications, this product showcases the expertise of its manufacturer while providing customers with exceptional value and benefits. Elevate your graphics display performance with the LP8552TLE-E01/NOPB and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product suitable for a wide range of applications.

Data Input Mode: SERIAL

Serial data input mode allows for easy integration with other systems and simplifies the communication process.

Surface Mount: YES

Surface mount capability enables easy installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 22 V

High maximum supply voltage allows for flexibility in power supply options and compatibility with a variety of systems.

Package Shape: SQUARE

Square package shape provides a compact design, saving space and making it suitable for devices with limited room.

No. of Terminals: 25

Having a higher number of terminals allows for more connectivity options and functionality in the product.

Minimum Supply Voltage: 5.5 V

Low minimum supply voltage ensures efficient power consumption and compatibility with low-power devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature allows for operation in cold environments without compromising performance.

Terminal Finish: TIN SILVER COPPER

This finish provides excellent conductivity and durability, ensuring reliable data transmission and long-term use.

Terminal Position: BOTTOM

Bottom terminal position simplifies the PCB layout and allows for easy connection with other components.

Maximum Seated Height: 0.675 mm

Low maximum seated height enables a slim and compact design, making the product suitable for thin devices.

Width: 2.466 mm

Narrow width allows for space-saving installation on PCBs and compatibility with devices with limited space.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum time at peak reflow temperature ensures quick and efficient soldering during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for reliable soldering and ensures strong connections on the PCB.

Length: 2.466 mm

Compact length ensures space-saving installation on PCBs and compatibility with devices of various sizes.

Terminal Form: BALL

Ball terminal form provides reliable connections and efficient data transmission, ensuring the product's overall performance.

Nominal Supply Voltage: 12 V

Stable nominal supply voltage ensures consistent performance and compatibility with a wide range of power sources.

No. of Segments: 12

Having multiple segments allows for versatile display options and enhanced visual presentations in the product.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables precise connections and compact design, making the product suitable for small-scale applications.

Minimum fmax 0.4 MHz

Low minimum fmax ensures efficient operation and fast data processing, enhancing the product's performance.

Interface IC Type: LED DISPLAY DRIVER

The LED display driver interface IC type provides efficient and reliable control over LED displays, ensuring optimal visual output.

Technical Specifications

Graphics Display Drivers LP8552TLE-E01/NOPB attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

S-PBGA-B25

JESD-609 Code:

e1

Length:

2.466 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Segments:

12

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.675 mm

Maximum Supply Voltage:

22 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.466 mm

Minimum fmax:

.4 MHz

Trade Compliance

LP8552TLE-E01/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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