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PCF8566TD

NXP Semiconductors

PCF8566TD by NXP Semiconductors

NXP Semiconductors' PCF8566TD is a graphics display driver with dot matrix display mode and serial data input. It operates at 3/5V, -40 to 85°C, and has 24 segments for multiplexed display applications. The small outline package measures 15.4mm x 7.55mm with a max seated height of 2.7mm, making it suitable for industrial temperature grade LCD driver interfaces.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Digiode

USA . 4,692 parts In-Stock

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Anansix

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Bristol Electronics

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Atlantic Semiconductor

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Nova Conductors

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Corohmni

South Africa . 958 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,787 parts In-Stock

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One Stop Electronics

USA . 430 parts In-Stock

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AZTECH Wire

Italy . 802 parts In-Stock

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Ampacity Inc.

Singapore . 1,339 parts In-Stock

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Semicontronic

India . 907 parts In-Stock

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$36.375

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Continental Prestige Electronics

USA . 3,920 parts In-Stock

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Argo Parts USA

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Corphita

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Advanced Electronics

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Overview

Experience unparalleled quality and reliability with the PCF8566TD by NXP Semiconductors, a leading manufacturer in the industry. This graphics display driver offers seamless integration for a variety of applications, delivering exceptional value and benefits to customers. With its dot matrix display mode, serial data input mode, and small outline package style, this product provides unmatched performance and versatility. Upgrade your projects with the PCF8566TD and unlock endless possibilities in display technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the display driver.

Display Mode: DOT MATRIX

Allows for versatile display options and more customization.

Data Input Mode: SERIAL

Enables efficient and accurate data input for the driver.

Surface Mount: YES

Facilitates easy installation and space-saving design.

Maximum Supply Voltage: 6 V

Allows for higher voltage supply for better performance.

Package Shape: RECTANGULAR

Facilitates easy integration into electronic devices.

Power Supplies (V): 3/5

Supports multiple power supply options for flexibility.

No. of Terminals: 40

Provides ample connectivity options for various configurations.

Maximum Operating Temperature: 85 °C

Ensures the driver can operate in high-temperature environments.

Technology: CMOS

Utilizes CMOS technology for efficient and low-power operation.

Technical Specifications

Graphics Display Drivers PCF8566TD attributes and parameters. Explore more Graphics Display Drivers devices from NXP Semiconductors

Specs

Data Input Mode:

SERIAL

Display Mode:

DOT MATRIX

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PDSO-G40

JESD-609 Code:

e0

Length:

15.4 mm

Moisture Sensitivity Level (MSL):

1

Multiplexed Display Capability:

YES

No. of Backplanes:

4-BP

No. of Functions:

1

No. of Segments:

24

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

TOTEM-POLE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP40,.5,30

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

240

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

2.7 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.09 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

3.5 V

Minimum Supply Voltage-1:

-3.5 V

Nominal Supply Voltage-1:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.762 mm

Terminal Position:

DUAL

Width:

7.55 mm

Trade Compliance

PCF8566TD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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