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LP8552TLE-E00

Texas Instruments

LP8552TLE-E00 by Texas Instruments

LP8552TLE-E00 by Texas Instruments is a Graphics Display Driver with 12 segments, operating at 5.5-22V. It features a serial data input mode and LED display driver interface IC type. Ideal for applications requiring a thin profile, fine pitch grid array package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,998 parts In-Stock

1+ parts

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7,998

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Digiode

USA . 2,894 parts In-Stock

1+ parts

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2,894

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 756 parts In-Stock

1+ parts

$6.906

100+ parts

-

1k+ parts

$7.510

10k+ parts

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756

$6.906

-

$7.510

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DigiPath Technology Company

USA . 144 parts In-Stock

1+ parts

$7.604

100+ parts

$6.996

1k+ parts

-

10k+ parts

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144

$7.604

$6.996

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ChromeModa Solutions

Germany . 2,191 parts In-Stock

1+ parts

$7.759

100+ parts

$6.362

1k+ parts

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10k+ parts

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2,191

$7.759

$6.362

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IDEA Electronic Components Group

UK . 1,065 parts In-Stock

1+ parts

$7.759

100+ parts

-

1k+ parts

$6.983

10k+ parts

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1,065

$7.759

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$6.983

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AZTECH Wire

Italy . 417 parts In-Stock

1+ parts

$10.779

100+ parts

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417

$10.779

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One Stop Electronics

USA . 903 parts In-Stock

1+ parts

$21.500

100+ parts

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903

$21.500

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 1,741 parts In-Stock

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1,741

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Overview

Elevate your display experience with the LP8552TLE-E00 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability. This graphics display driver is perfect for a wide range of applications, offering seamless integration and exceptional performance. With a sleek design and cutting-edge technology, this product provides value, benefits, and advantages that customers can trust. Upgrade your display systems today with the LP8552TLE-E00 and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Data Input Mode: SERIAL

Serial data input mode allows for efficient and reliable data transfer, making it suitable for high-performance applications.

Surface Mount: YES

Surface mount design offers easy and secure installation, making it ideal for compact and space-constrained applications.

Maximum Supply Voltage: 22 V

High maximum supply voltage allows for versatile power options, accommodating a wide range of operating conditions.

Package Shape: SQUARE

Square package shape is efficient for component layout and space utilization, contributing to a more compact overall design.

No. of Terminals: 25

Having 25 terminals provides ample connection points for various interfaces and peripherals, enhancing compatibility with different systems.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with a thin profile and fine pitch improves signal integrity and reliability, ensuring optimal performance.

Minimum Supply Voltage: 5.5 V

Low minimum supply voltage enables efficient power consumption and operation at lower power levels, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance in various environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature range allows for operation in cold environments without compromising performance, increasing the product's versatility.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and soldering, enhancing the ease of installation and maintenance.

Maximum Seated Height: 0.675 mm

Low maximum seated height contributes to a slim design and minimizes the overall footprint, making it suitable for space-constrained applications.

Width: 2.466 mm

Compact width dimension allows for easy integration into tight spaces and enhances the overall compactness of the product.

Length: 2.466 mm

Compact length dimension ensures a space-saving design and efficient use of board space, contributing to a streamlined overall layout.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and solder joints, ensuring long-term stability and performance.

Nominal Supply Voltage: 12 V

Nominal supply voltage of 12 V offers a balanced power input for stable and consistent operation, maintaining performance efficiency.

No. of Segments: 12

Having 12 segments allows for versatile display configurations and information presentation, enhancing flexibility in visual output.

Terminal Pitch: 0.5 mm

Small terminal pitch of 0.5 mm facilitates high-density mounting and compact PCB design, maximizing space efficiency.

Minimum fmax: 0.4 MHz

Low minimum fmax value of 0.4 MHz indicates high speed and responsiveness for data processing, ensuring efficient performance.

Interface IC Type: LED DISPLAY DRIVER

LED display driver interface IC type ensures compatibility with LED displays, enabling seamless integration and optimal control over display functionalities.

Technical Specifications

Graphics Display Drivers LP8552TLE-E00 attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

S-PBGA-B25

Length:

2.466 mm

No. of Functions:

1

No. of Segments:

12

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.675 mm

Maximum Supply Voltage:

22 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

2.466 mm

Minimum fmax:

.4 MHz

Trade Compliance

LP8552TLE-E00 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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