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LP8552TLE-E00/NOPB

Texas Instruments

LP8552TLE-E00/NOPB by Texas Instruments

LP8552TLE-E00/NOPB by Texas Instruments is a graphics display driver with 12 segments, operating at 5.5-22V. It features a serial data input mode, very thin profile grid array package style, and terminal pitch of 0.5mm. Ideal for LED displays, it has a peak reflow temp of 260C and operates b/w -30 to 85C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,963 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,963

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Vyrian

USA . 2,774 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,774

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 734 parts In-Stock

1+ parts

$4.629

100+ parts

$429.863

1k+ parts

$4.166

10k+ parts

-

734

$4.629

$429.863

$4.166

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DigiPath Technology Company

USA . 1,681 parts In-Stock

1+ parts

$5.097

100+ parts

$4.689

1k+ parts

-

10k+ parts

-

1,681

$5.097

$4.689

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ChromeModa Solutions

Germany . 2,531 parts In-Stock

1+ parts

$5.201

100+ parts

$4.265

1k+ parts

-

10k+ parts

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2,531

$5.201

$4.265

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IDEA Electronic Components Group

UK . 1,056 parts In-Stock

1+ parts

$5.201

100+ parts

-

1k+ parts

$4.681

10k+ parts

-

1,056

$5.201

-

$4.681

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AZTECH Wire

Italy . 700 parts In-Stock

1+ parts

$19.567

100+ parts

-

1k+ parts

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10k+ parts

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700

$19.567

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One Stop Electronics

USA . 467 parts In-Stock

1+ parts

$30.500

100+ parts

-

1k+ parts

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10k+ parts

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467

$30.500

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Microchip USA

USA . 2,850 parts In-Stock

1+ parts

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2,850

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Corphita

USA . 917 parts In-Stock

1+ parts

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917

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Overview

Elevate your display experience with the LP8552TLE-E00/NOPB by Texas Instruments. Crafted with precision and quality, this graphics display driver offers unparalleled performance and reliability. Designed for a wide range of applications, this product stands out with its advanced features and cutting-edge technology. Enhance your projects with ease and efficiency, thanks to the value and benefits this product brings to the table. Trust Texas Instruments for superior products that deliver top-notch results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the graphics display driver, ensuring a longer lifespan.

Data Input Mode: SERIAL

Serial data input mode allows for efficient and streamlined communication with other devices, enhancing overall performance.

Surface Mount: YES

Surface mount capability makes installation and integration into electronic devices easier and more compact.

Maximum Supply Voltage: 22 V

The high maximum supply voltage allows for versatile compatibility with different power sources and systems.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The fine pitch and thin profile design of the package allows for a compact and space-saving installation, ideal for modern electronics.

Minimum Operating Temperature: -30 °C

The wide range of operating temperatures ensures reliable performance in various environmental conditions.

Nominal Supply Voltage: 12 V

The standard nominal supply voltage of 12V is commonly used in electronic devices, making this graphics display driver compatible with a wide range of applications.

Interface IC Type: LED DISPLAY DRIVER

The LED display driver interface IC type ensures compatibility with LED displays, making it an excellent choice for applications requiring LED technology.

Technical Specifications

Graphics Display Drivers LP8552TLE-E00/NOPB attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

S-PBGA-B25

JESD-609 Code:

e1

Length:

2.466 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Segments:

12

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.675 mm

Maximum Supply Voltage:

22 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.466 mm

Minimum fmax:

.4 MHz

Trade Compliance

LP8552TLE-E00/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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