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LP8551TLE/NOPB

Texas Instruments

LP8551TLE/NOPB by Texas Instruments

LP8551TLE/NOPB by Texas Instruments is a graphics display driver with 4 channels, constant-current output. It operates b/w -30 to 85 °C and supports a max supply voltage of 22 V. Ideal for LED displays, it features a serial data input mode and comes in a square package shape.

Median Price

$1.706

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 28,420 parts In-Stock

1+ parts

$1.987

100+ parts

$1.641

1k+ parts

$0.887

10k+ parts

-

28,420

$1.987

$1.641

$0.887

-

Mouser Electronics

USA . 24 parts In-Stock

1+ parts

$3.000

100+ parts

$1.850

1k+ parts

$1.550

10k+ parts

$1.540

24

$3.000

$1.850

$1.550

$1.540

Rochester

USA . 5,595 parts In-Stock

1+ parts

-

100+ parts

$1.270

1k+ parts

$1.140

10k+ parts

$1.070

5,595

-

$1.270

$1.140

$1.070

Verical

USA . 5,095 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.425

10k+ parts

$1.337

5,095

-

-

$1.425

$1.337

DigiKey

USA . 680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

680

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 539 parts In-Stock

1+ parts

$1.168

100+ parts

-

1k+ parts

-

10k+ parts

-

539

$1.168

-

-

-

Vyrian

USA . 3,789 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,789

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,646 parts In-Stock

1+ parts

$1.107

100+ parts

-

1k+ parts

-

10k+ parts

-

1,646

$1.107

-

-

-

Parana Technologies

USA . 318 parts In-Stock

1+ parts

$3.216

100+ parts

-

1k+ parts

$3.738

10k+ parts

-

318

$3.216

-

$3.738

-

DigiPath Technology Company

USA . 1,600 parts In-Stock

1+ parts

$3.542

100+ parts

-

1k+ parts

-

10k+ parts

-

1,600

$3.542

-

-

-

ChromeModa Solutions

Germany . 1,417 parts In-Stock

1+ parts

$3.614

100+ parts

$2.963

1k+ parts

-

10k+ parts

-

1,417

$3.614

$2.963

-

-

IDEA Electronic Components Group

UK . 180 parts In-Stock

1+ parts

$3.614

100+ parts

-

1k+ parts

$3.253

10k+ parts

-

180

$3.614

-

$3.253

-

Perfect Parts

USA . 1,805 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,805

-

-

-

-

GreenTree Electronics

Israel . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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250

-

-

-

-

Overview

Elevate your graphics display experience with the LP8551TLE/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that push the boundaries of innovation. The LP8551TLE/NOPB is a versatile solution for various applications in the realm of graphic display drivers, offering customers unparalleled value and benefits. Experience seamless performance, superior reliability, and unmatched efficiency with this product. Upgrade your display systems and unlock a world of possibilities with the LP8551TLE/NOPB from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and provide good protection for the internal components of the graphics display driver.

Data Input Mode: SERIAL

Serial data input mode allows for efficient and reliable communication between the driver and the connected display devices.

Surface Mount: YES

Surface mount capability makes installation and integration of the driver easier and more convenient.

Maximum Supply Voltage: 22 V

High maximum supply voltage allows for versatility in power source options and compatibility with various systems.

Package Shape: SQUARE

Square package shape helps in efficient layout and placement of the driver on a circuit board.

Power Supplies (V): 12

Stable power supply of 12V ensures consistent and reliable performance of the display driver.

No. of Terminals: 25

Having 25 terminals allows for flexibility in connecting to different components and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with a thin profile and fine pitch improves signal integrity and reduces space requirements on the PCB.

Minimum Operating Temperature: -30 °C

Wide operating temperature range from -30°C ensures reliability in various environmental conditions.

Maximum Seated Height: 0.675 mm

Low seated height enables compact design and integration of the graphics display driver in space-constrained applications.

Technical Specifications

Graphics Display Drivers LP8551TLE/NOPB attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Data Input Mode:

SERIAL

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

S-PBGA-B25

JESD-609 Code:

e1

Length:

2.46 mm

Moisture Sensitivity Level (MSL):

1

Multiplexed Display Capability:

NO

No. of Channels:

4

No. of Functions:

1

No. of Segments:

4

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Output Characteristics:

CONSTANT-CURRENT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA25,5X5,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Sub-Category:

Display Drivers

Maximum Supply Current:

.001 mA

Maximum Supply Voltage:

22 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

12 V

Maximum Supply Voltage-1:

5 V

Minimum Supply Voltage-1:

1.65 V

Nominal Supply Voltage-1:

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.46 mm

Minimum fmax:

.025 MHz

Trade Compliance

LP8551TLE/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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