Loading...

LMV1099TL

Texas Instruments

LMV1099TL by Texas Instruments

LMV1099TL by Texas Instruments is a telecom interface IC with 25 terminals in a grid array package. It operates b/w -40°C to 85°C, suitable for industrial applications. With a nominal voltage of 3.6V and very thin profile, it's ideal for telecom circuit designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,515 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,515

-

-

-

-

Anansix

USA . 1,972 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,972

-

-

-

-

Digiode

USA . 930 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

930

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 347 parts In-Stock

1+ parts

$5.662

100+ parts

-

1k+ parts

$6.458

10k+ parts

-

347

$5.662

-

$6.458

-

DigiPath Technology Company

USA . 2,225 parts In-Stock

1+ parts

$6.235

100+ parts

-

1k+ parts

-

10k+ parts

-

2,225

$6.235

-

-

-

IDEA Electronic Components Group

UK . 1,303 parts In-Stock

1+ parts

$6.362

100+ parts

-

1k+ parts

$5.726

10k+ parts

-

1,303

$6.362

-

$5.726

-

ChromeModa Solutions

Germany . 692 parts In-Stock

1+ parts

$6.362

100+ parts

$5.217

1k+ parts

-

10k+ parts

-

692

$6.362

$5.217

-

-

AZTECH Wire

Italy . 509 parts In-Stock

1+ parts

$13.443

100+ parts

-

1k+ parts

-

10k+ parts

-

509

$13.443

-

-

-

One Stop Electronics

USA . 1,288 parts In-Stock

1+ parts

$938.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,288

$938.000

-

-

-

Corphita

USA . 582 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

582

-

-

-

-

Overview

Enhance your telecommunications projects with the LMV1099TL by Texas Instruments. Known for their top-notch quality, Texas Instruments delivers cutting-edge solutions in the Other Function Telecom Interface ICs category. This versatile product offers customers unparalleled value and benefits, from its innovative design to its reliable performance. Whether you're looking to improve connectivity or enhance communication systems, the LMV1099TL is the perfect choice for your next project. Unlock the potential of your telecom applications with Texas Instruments' LMV1099TL.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and resistance to external factors, making the product suitable for long-term use in various conditions.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into compact PCB designs, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

Rectangular package shape facilitates efficient placement on a PCB, optimizing board layout and maximizing space utilization.

No. of Terminals: 25

Having 25 terminals provides ample connectivity options for interfacing with other components and devices, enabling versatile functionality.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch design enhance signal integrity and reliability, leading to improved performance in telecom applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand elevated temperature environments without compromising functionality.

Minimum Operating Temperature: -40 °C

The product's low minimum operating temperature of -40°C ensures reliable operation even in cold conditions, offering versatility in various environments.

Terminal Position: BOTTOM

Bottom terminal positioning enables easy access and connection to other components, simplifying installation and maintenance processes.

Maximum Seated Height: 0.675 mm

The low maximum seated height of 0.675 mm allows for a slim profile and compact form factor, ideal for space-constrained applications.

Width: 2.644 mm

The narrow width of 2.644 mm facilitates efficient board layout and component placement, contributing to a streamlined and optimized design.

Length: 2.771 mm

The compact length of 2.771 mm conserves space on the PCB, enabling a more efficient and effective layout for telecom interface applications.

Temperature Grade: INDUSTRIAL

Being industrial-grade ensures the product meets stringent reliability and performance standards for telecom applications in demanding industrial environments.

Terminal Form: BALL

The use of ball terminals enhances connectivity and reliability, providing secure connections and reducing the risk of signal loss or data corruption.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuit applications, ensuring optimized performance, compatibility, and reliability in telecommunications systems.

Nominal Supply Voltage: 3.6 V

The nominal supply voltage of 3.6 V aligns with typical power requirements for telecom applications, ensuring compatibility and reliable operation.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density integration and precise connections, essential for telecom interface ICs in compact electronic devices.

Technical Specifications

Other Function Telecom Interface ICs LMV1099TL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PBGA-B25

Length:

2.771 mm

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

2.644 mm

Trade Compliance

LMV1099TL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 5