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LMV1099TL/NOPB

Texas Instruments

LMV1099TL/NOPB by Texas Instruments

LMV1099TL/NOPB by Texas Instruments is a telecom interface IC with 25 terminals in a square grid array package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3.6V, it features very thin profile and fine pitch for telecom circuit applications.

Median Price

$2.300

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,939 parts In-Stock

1+ parts

-

100+ parts

$2.060

1k+ parts

$1.840

10k+ parts

$1.740

15,939

-

$2.060

$1.840

$1.740

Verical

USA . 9,329 parts In-Stock

1+ parts

-

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$2.300

10k+ parts

$2.175

9,329

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$2.300

$2.175

DigiKey

USA . 3,653 parts In-Stock

1+ parts

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$2.710

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3,653

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$2.710

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Distributors (In-Stock)

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Digiode

USA . 3,086 parts In-Stock

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$1.900

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3,086

$1.900

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Vyrian

USA . 1,520 parts In-Stock

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$2.000

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$2.000

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DigiKey Marketplace

USA . 3,653 parts In-Stock

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3,653

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Anansix

USA . 1,291 parts In-Stock

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1,291

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Connector Distribution Corp

USA . 101 parts In-Stock

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101

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Right Parts Inc.

USA . 101 parts In-Stock

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101

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Distributors (Availability)

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Vigor

Singapore . 2,369 parts In-Stock

1+ parts

$1.760

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2,369

$1.760

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Corphita

USA . 2,848 parts In-Stock

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$1.800

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2,848

$1.800

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Parana Technologies

USA . 24 parts In-Stock

1+ parts

$5.932

100+ parts

$550.862

1k+ parts

$5.339

10k+ parts

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24

$5.932

$550.862

$5.339

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DigiPath Technology Company

USA . 1,987 parts In-Stock

1+ parts

$6.532

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1,987

$6.532

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IDEA Electronic Components Group

UK . 2,186 parts In-Stock

1+ parts

$6.665

100+ parts

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1k+ parts

$5.998

10k+ parts

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2,186

$6.665

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$5.998

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ChromeModa Solutions

Germany . 703 parts In-Stock

1+ parts

$6.665

100+ parts

$5.465

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703

$6.665

$5.465

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QUARKTWIN TECHNOLOGY LTD

USA . 12,460 parts In-Stock

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Microchip USA

USA . 4,968 parts In-Stock

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Perfect Parts

USA . 1,014 parts In-Stock

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1,014

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Overview

Enhance your telecom interface systems with the LMV1099TL/NOPB by Texas Instruments, a top-quality manufacturer known for cutting-edge technology. This square-shaped IC with a grid array package style offers 25 terminals and a very thin profile design, perfect for various applications in the telecommunications industry. Providing exceptional value with its industrial temperature grade and nominal supply voltage of 3.6V, this product ensures reliable performance and optimal functionality for all your telecom needs. Upgrade your systems today with the LMV1099TL/NOPB and experience the benefits of superior quality and advanced technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on PCBs, ideal for mass production and compact designs.

Package Shape: SQUARE

Square packages can help in optimizing board space and improving thermal performance.

No. of Terminals: 25

Having a sufficient number of terminals allows for connectivity to multiple components and interfaces.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures makes the product suitable for both hot and cold environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections over time.

Maximum Seated Height: 0.675 mm

Low profile design saves space and allows for compact device designs.

Width: 2.64 mm

Compact width allows for efficient use of board space in tight layouts.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for reliable soldering during assembly processes.

Nominal Supply Voltage: 3.6 V

Nominal supply voltage compatibility makes the product suitable for a wide range of applications.

Technical Specifications

Other Function Telecom Interface ICs LMV1099TL/NOPB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XBGA-B25

JESD-609 Code:

e1

Length:

2.764 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.675 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.64 mm

Trade Compliance

LMV1099TL/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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