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LMV1099TLX

Texas Instruments

LMV1099TLX by Texas Instruments

LMV1099TLX by Texas Instruments is a telecom IC with 25 terminals in a grid array package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3.6V, it is designed for telecom circuit applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 5,211 parts In-Stock

1+ parts

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5,211

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Vyrian

USA . 3,192 parts In-Stock

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3,192

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Anansix

USA . 875 parts In-Stock

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875

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,193 parts In-Stock

1+ parts

$7.052

100+ parts

-

1k+ parts

$7.592

10k+ parts

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1,193

$7.052

-

$7.592

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ChromeModa Solutions

Germany . 3,799 parts In-Stock

1+ parts

$7.924

100+ parts

$6.498

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-

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3,799

$7.924

$6.498

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IDEA Electronic Components Group

UK . 2,099 parts In-Stock

1+ parts

$7.924

100+ parts

-

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$7.132

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2,099

$7.924

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$7.132

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AZTECH Wire

Italy . 389 parts In-Stock

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$13.221

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389

$13.221

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One Stop Electronics

USA . 395 parts In-Stock

1+ parts

$887.000

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395

$887.000

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Corphita

USA . 3,658 parts In-Stock

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3,658

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DigiPath Technology Company

USA . 631 parts In-Stock

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$7.144

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631

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$7.144

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Overview

Elevate your telecom interface designs with the LMV1099TLX by Texas Instruments. Crafted with precision and expertise, this cutting-edge IC promises unrivaled quality and reliability. From its sleek package body material to its advanced terminal form, every detail has been meticulously engineered for optimal performance. Whether you're in telecommunications, networking, or beyond, this versatile product offers unmatched value and benefits. Experience seamless integration, enhanced functionality, and superior results with the LMV1099TLX. Choose excellence with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight, durable, and cost-effective, making it ideal for telecom interface ICs.

Surface Mount: YES

Surface mount design allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand challenging environmental conditions without sacrificing performance.

Nominal Supply Voltage: 3.6 V

The 3.6 V supply voltage is suitable for many telecom applications, ensuring compatibility and reliable operation.

Technical Specifications

Other Function Telecom Interface ICs LMV1099TLX attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PBGA-B25

Length:

2.771 mm

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

2.644 mm

Trade Compliance

LMV1099TLX Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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