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LM5051MA

Texas Instruments

LM5051MA by Texas Instruments

LM5051MA by Texas Instruments is a MOSFET gate driver with a supply voltage range of 4.5V to 14.5V, suitable for automotive applications. It features a small outline package style, dual terminal position, and operates in temperatures from -40°C to 125°C. Ideal for half-bridge based MOSFET driver interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,131 parts In-Stock

1+ parts

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4,131

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Vyrian

USA . 2,471 parts In-Stock

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2,471

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,226 parts In-Stock

1+ parts

$11.728

100+ parts

-

1k+ parts

$12.123

10k+ parts

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1,226

$11.728

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$12.123

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DigiPath Technology Company

USA . 2,271 parts In-Stock

1+ parts

$12.914

100+ parts

$11.881

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2,271

$12.914

$11.881

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ChromeModa Solutions

Germany . 3,459 parts In-Stock

1+ parts

$13.178

100+ parts

$10.806

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3,459

$13.178

$10.806

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IDEA Electronic Components Group

UK . 1,576 parts In-Stock

1+ parts

$13.178

100+ parts

$12.519

1k+ parts

$11.860

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1,576

$13.178

$12.519

$11.860

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AZTECH Wire

Italy . 740 parts In-Stock

1+ parts

$16.036

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740

$16.036

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One Stop Electronics

USA . 557 parts In-Stock

1+ parts

$41.500

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557

$41.500

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Alle Elektronik GmbH

Germany . 4,774 parts In-Stock

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4,774

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Corphita

USA . 2,068 parts In-Stock

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2,068

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Metaverse IC Inc.

Canada . 1,313 parts In-Stock

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1,313

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Overview

Enhance your electronic projects with the LM5051MA by Texas Instruments, a top-quality MOSFET Gate Driver designed for reliability and precision. Perfect for a wide range of applications, this product offers unparalleled value and benefits to customers seeking superior performance and efficiency. With Texas Instruments' reputation for excellence in manufacturing, you can trust that the LM5051MA will exceed your expectations. Experience the advantages of this innovative technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the gate driver, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability makes installation and assembly easier, saving time and effort for the user.

Maximum Supply Voltage: 14.5 V

Allows for a wide range of voltage inputs, making this gate driver compatible with a variety of systems and applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into existing circuit designs and layouts.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting to other components and peripherals, allowing for a more versatile setup.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board, making this gate driver suitable for compact designs or densely populated PCBs.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage requirement ensures efficient performance even in low-power applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance ensures stability and reliability even in demanding environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in both extreme cold and hot conditions, making this gate driver versatile and robust.

Terminal Position: DUAL

Dual terminal position provides redundancy and backup connection points, enhancing the reliability and robustness of the gate driver.

Maximum Seated Height: 1.75 mm

Low seated height allows for a compact and slim form factor, ideal for space-constrained applications or designs with height restrictions.

Width: 3.9 mm

Narrow width enables easy placement on the PCB and efficient use of board space, especially in designs where space is limited.

Length: 4.9 mm

Compact length makes this gate driver suitable for applications where size constraints are a concern, without compromising on performance.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures that this gate driver meets the stringent requirements for automotive applications, providing reliability and performance in vehicle systems.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering and assembly processes, making installation easier and more convenient for the user.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V is a common and widely used voltage level, ensuring compatibility with most systems and power sources.

Terminal Pitch: 1.27 mm

Terminal pitch of 1.27mm provides secure and reliable connections, reducing the risk of signal interference or disconnections.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

Half bridge based MOSFET driver interface IC type offers efficient power management and control capabilities, making this gate driver suitable for a wide range of power electronic applications.

Technical Specifications

MOSFET Gate Drivers LM5051MA attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

High Side Driver:

NO

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

14.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

LM5051MA Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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