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LM5051MAX/NOPB

Texas Instruments

LM5051MAX/NOPB by Texas Instruments

LM5051MAX/NOPB by Texas Instruments is a MOSFET gate driver with power supplies ranging from 4.5V to 13V, suitable for automotive applications. It features a small outline package style, matte tin terminal finish, and operates in temperatures from -40°C to 125°C. Ideal for driving half-bridge based MOSFETs in compact electronic systems.

Median Price

$2.720

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 59,710 parts In-Stock

1+ parts

$1.949

100+ parts

$1.610

1k+ parts

$0.870

10k+ parts

-

59,710

$1.949

$1.610

$0.870

-

Mouser Electronics

USA . 74 parts In-Stock

1+ parts

$2.720

100+ parts

$1.660

1k+ parts

$1.500

10k+ parts

$1.390

74

$2.720

$1.660

$1.500

$1.390

DigiKey

USA . 421 parts In-Stock

1+ parts

$2.960

100+ parts

$1.816

1k+ parts

$1.686

10k+ parts

-

421

$2.960

$1.816

$1.686

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$1.351

100+ parts

-

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550

$1.351

-

-

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Digiode

USA . 3,992 parts In-Stock

1+ parts

$1.852

100+ parts

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3,992

$1.852

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Chip Stock

USA . 26,110 parts In-Stock

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26,110

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Vyrian

USA . 21,649 parts In-Stock

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21,649

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Cyclops Electronics Ltd

UK . 4,070 parts In-Stock

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4,070

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Bristol Electronics

USA . 1,746 parts In-Stock

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1,746

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Atlantic Semiconductor

USA . 1,746 parts In-Stock

1+ parts

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1,746

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Semi Source

USA . 698 parts In-Stock

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698

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Sensible Micro Corp

USA . 49 parts In-Stock

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49

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,663 parts In-Stock

1+ parts

$1.351

100+ parts

-

1k+ parts

-

10k+ parts

$1.324

6,663

$1.351

-

-

$1.324

Argo Parts USA

USA . 2,385 parts In-Stock

1+ parts

$1.351

100+ parts

-

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2,385

$1.351

-

-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.351

100+ parts

-

1k+ parts

$1.283

10k+ parts

$1.256

2,000

$1.351

-

$1.283

$1.256

Semicontronic

India . 21,678 parts In-Stock

1+ parts

$1.660

100+ parts

$1.618

1k+ parts

$1.610

10k+ parts

-

21,678

$1.660

$1.618

$1.610

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Ampacity Inc.

Singapore . 21,544 parts In-Stock

1+ parts

$1.660

100+ parts

-

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21,544

$1.660

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Corphita

USA . 4,957 parts In-Stock

1+ parts

$1.754

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4,957

$1.754

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Parana Technologies

USA . 650 parts In-Stock

1+ parts

$4.072

100+ parts

-

1k+ parts

$4.534

10k+ parts

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650

$4.072

-

$4.534

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Corohmni

South Africa . 304 parts In-Stock

1+ parts

$4.403

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304

$4.403

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DigiPath Technology Company

USA . 1,248 parts In-Stock

1+ parts

$4.484

100+ parts

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1,248

$4.484

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ChromeModa Solutions

Germany . 4,154 parts In-Stock

1+ parts

$4.575

100+ parts

$3.752

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4,154

$4.575

$3.752

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IDEA Electronic Components Group

UK . 1,639 parts In-Stock

1+ parts

$4.575

100+ parts

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1k+ parts

$4.118

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1,639

$4.575

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$4.118

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Perfect Parts

USA . 95,091 parts In-Stock

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A-Z Elektronik GmbH

Germany . 17,284 parts In-Stock

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S.R.D Solutions

India . 12,000 parts In-Stock

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Lixinc

USA . 10,486 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,856 parts In-Stock

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4,856

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Infinite Electronics LLP (Excess)

. 2,742 parts In-Stock

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2,742

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Formix International (Excess)

India . 2,677 parts In-Stock

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2,677

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Assy Fe

Spain . 2,333 parts In-Stock

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2,333

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Technoshack Inc. (Excess)

Canada . 1,600 parts In-Stock

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1,600

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GreenTree Electronics

Israel . 500 parts In-Stock

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500

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Authorized Procurement Solutions

USA . 400 parts In-Stock

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400

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iodParts Technologies Inc.

India . 185 parts In-Stock

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185

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Overview

Upgrade your power management systems with the LM5051MAX/NOPB by Texas Instruments, a top-quality MOSFET Gate Driver that guarantees efficiency and reliability. With a wide operating temperature range and automotive-grade quality, this product offers unparalleled performance in a compact package. Ideal for various applications, from automotive to industrial, this driver ensures seamless operation and optimal power supply management. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and enhances your projects. Elevate your designs with the LM5051MAX/NOPB and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material choice provides durability and protection for the internal components of the gate driver, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Being surface mountable makes installation and assembly easier and more efficient, saving time and effort in the production process.

Package Shape: RECTANGULAR

The rectangular shape allows for easier integration into circuit designs and layouts, optimizing space usage within electronic devices.

Power Supplies (V): 4.5/13

Supporting a range of power supplies enables compatibility with a variety of systems and applications, making it versatile and adaptable for different uses.

No. of Terminals: 8

Having 8 terminals allows for more connections and configurations, offering flexibility in circuit design and functionality.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this gate driver can reliably function in demanding conditions without overheating or performance degradation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the gate driver can operate effectively in cold environments, expanding its range of use cases.

Terminal Finish: MATTE TIN

The matte tin finish provides good conductivity and corrosion resistance, enhancing the reliability and longevity of the connections.

Terminal Position: DUAL

Dual terminal positions offer more flexibility in circuit board layout and component placement, allowing for optimized design configurations.

Maximum Seated Height: 1.75 mm

The low seated height makes this gate driver suitable for compact and slim devices where space is limited.

Width: 3.91 mm

The narrow width of the package allows for efficient use of board space and enables compact designs for electronic systems.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures quick and effective soldering during assembly, contributing to the overall reliability and performance of the product.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this gate driver can withstand the soldering process without damage or degradation, ensuring proper functionality.

Length: 4.9 mm

The compact length of the package contributes to space-saving designs and allows for versatile placement within electronic devices.

Temperature Grade: AUTOMOTIVE

Being automotive-grade means this gate driver meets stringent quality and reliability standards required for use in automotive applications, ensuring robust performance in challenging environments.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and secure connections, enhancing the overall durability and stability of the gate driver.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for fine spacing between terminals, enabling precise connections and reducing the risk of short circuits or electrical interference.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

The use of a half bridge based MOSFET driver provides efficient switching control for MOSFETs, enabling high performance and reliability in driving power electronics.

Technical Specifications

MOSFET Gate Drivers LM5051MAX/NOPB attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/13

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

MOSFET Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.91 mm

Trade Compliance

LM5051MAX/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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