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LM10500SQ-0.8

Texas Instruments

LM10500SQ-0.8 by Texas Instruments

LM10500SQ-0.8 by Texas Instruments is a Power Management IC with 28 terminals, operating b/w -40 to 85°C. It supports supply voltages from 3V to 18V and has a compact square package suitable for industrial applications. With a low profile of 0.8mm, it's ideal for space-constrained designs requiring efficient power management.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,729 parts In-Stock

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Digiode

USA . 223 parts In-Stock

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223

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One Stop Electronics

USA . 1,571 parts In-Stock

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$3.500

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1,571

$3.500

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Semicontronic

India . 533 parts In-Stock

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$5.500

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$5.362

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$5.335

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533

$5.500

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$5.335

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AZTECH Wire

Italy . 572 parts In-Stock

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$17.040

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572

$17.040

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Parana Technologies

USA . 2,218 parts In-Stock

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$19.731

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$19.708

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$19.731

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$19.708

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DigiPath Technology Company

USA . 1,253 parts In-Stock

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$21.727

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$21.727

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IDEA Electronic Components Group

UK . 1,952 parts In-Stock

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$22.170

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$21.062

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$19.953

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1,952

$22.170

$21.062

$19.953

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ChromeModa Solutions

Germany . 1,418 parts In-Stock

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$22.170

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$18.179

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$22.170

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 1,456 parts In-Stock

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Corohmni

South Africa . 369 parts In-Stock

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Overview

Experience unparalleled efficiency and reliability with the LM10500SQ-0.8 by Texas Instruments, a cutting-edge Power Management IC that is setting new standards in the industry. Designed for industrial-grade applications, this chip carrier boasts a very thin profile and a wide operational temperature range, making it ideal for a variety of power supply support circuits. With Texas Instruments' renowned quality and innovation behind it, you can trust that the LM10500SQ-0.8 will deliver exceptional performance and longevity, ensuring your projects run smoothly and efficiently. Elevate your designs with this high-quality solution today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount feature allows for easy installation and integration onto circuit boards, saving time and effort in assembly.

Nominal Supply Voltage (Vsup): 12 V

Designed to operate at a standard 12V supply voltage, ensuring compatibility and reliability in various applications.

No. of Terminals: 28

With a high number of terminals, this power management IC offers versatile connectivity options for different components and peripherals.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, providing stability and performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Can function effectively in extremely low temperatures, making it suitable for a wide range of industrial and automotive applications.

Terminal Position: QUAD

Quad terminal position ensures efficient power distribution and control, maximizing the IC's performance and reliability.

Width (mm): 5 mm

Compact and slim design with a width of 5mm makes it easy to integrate into space-constrained devices and systems.

Minimum Supply Voltage (Vsup): 3 V

Can operate at low supply voltages, enabling energy-efficient performance and flexibility in powering various electronic devices.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature range, ensuring reliable operation in demanding environments such as factories and production facilities.

Maximum Supply Voltage (Vsup): 18 V

Supports a maximum supply voltage of 18V, providing a wide voltage range for compatibility with different power sources and systems.

Technical Specifications

Power Management ICs LM10500SQ-0.8 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-XQCC-N28

Length:

5 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

5 mm

Trade Compliance

LM10500SQ-0.8 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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