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LM10502TLE/NOPB

Texas Instruments

LM10502TLE/NOPB by Texas Instruments

LM10502TLE/NOPB by Texas Instruments is a Power Management IC with 25 terminals, operating at -30 to 125°C. It has a max output current of 1A and supports a switching frequency of up to 2300 kHz. Ideal for power supply applications requiring adjustable thresholds and multiple outputs in compact designs.

Median Price

$1.887

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,750 parts In-Stock

1+ parts

-

100+ parts

$1.690

1k+ parts

$1.510

10k+ parts

$1.420

10,750

-

$1.690

$1.510

$1.420

DigiKey

USA . 10,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.230

10k+ parts

-

10,750

-

-

$2.230

-

Verical

USA . 10,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.887

10k+ parts

$1.775

10,750

-

-

$1.887

$1.775

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,603 parts In-Stock

1+ parts

$1.776

100+ parts

-

1k+ parts

-

10k+ parts

-

2,603

$1.776

-

-

-

DigiKey Marketplace

USA . 10,750 parts In-Stock

1+ parts

-

100+ parts

$1.940

1k+ parts

-

10k+ parts

-

10,750

-

$1.940

-

-

Vyrian

USA . 4,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,520

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,544 parts In-Stock

1+ parts

$1.683

100+ parts

-

1k+ parts

-

10k+ parts

-

2,544

$1.683

-

-

-

Microchip USA

USA . 1,002 parts In-Stock

1+ parts

$16.340

100+ parts

$16.230

1k+ parts

$16.180

10k+ parts

$16.130

1,002

$16.340

$16.230

$16.180

$16.130

Parana Technologies

USA . 210 parts In-Stock

1+ parts

$19.234

100+ parts

-

1k+ parts

$19.274

10k+ parts

-

210

$19.234

-

$19.274

-

DigiPath Technology Company

USA . 1,501 parts In-Stock

1+ parts

$21.179

100+ parts

$19.484

1k+ parts

-

10k+ parts

-

1,501

$21.179

$19.484

-

-

IDEA Electronic Components Group

UK . 1,231 parts In-Stock

1+ parts

$21.611

100+ parts

$20.530

1k+ parts

$19.450

10k+ parts

-

1,231

$21.611

$20.530

$19.450

-

ChromeModa Solutions

Germany . 336 parts In-Stock

1+ parts

$21.611

100+ parts

$17.721

1k+ parts

-

10k+ parts

-

336

$21.611

$17.721

-

-

Overview

Experience unmatched quality and reliability with the LM10502TLE/NOPB by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch Power Management ICs that are perfect for a wide range of applications. Whether you're looking to optimize power supply support circuits or enhance your power management system, this product offers exceptional value, benefits, and advantages. Trust in Texas Instruments to provide you with cutting-edge technology that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material that provides good protection for the internal components.

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards.

Nominal Supply Voltage (Vsup): 5 V

Standard voltage level that is commonly used in many electronic devices.

No. of Terminals: 25

Provides multiple connection points for different components, allowing for flexibility in circuit design.

Maximum Operating Temperature: 125 °C

Can operate in high temperature environments without overheating.

Minimum Output Voltage: 0.7 V

Can provide a low output voltage level, suitable for powering sensitive electronic components.

Minimum Operating Temperature: -30 °C

Can operate in cold temperature environments without performance issues.

Terminal Finish: TIN SILVER COPPER

Provides a reliable and conductive terminal finish for secure connections.

Maximum Output Voltage: 3.6 V

Can provide a moderately high output voltage level for powering various components.

Maximum Seated Height: 0.675 mm

Compact and low-profile design for space-constrained applications.

Width (mm): 2.46 mm

Small width for easy integration into compact electronic devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed to support power supply functions, ensuring stable and efficient power delivery.

Minimum Supply Voltage (Vsup): 3 V

Can operate at lower supply voltage levels, suitable for battery-powered devices.

Maximum Switching Frequency: 2300 kHz

High switching frequency for efficient power conversion and regulation.

Maximum Output Current: 1 A

Capable of delivering a moderate output current for powering various components.

Terminal Pitch: 0.5 mm

Fine pitch terminals for precise and secure connections.

Maximum Supply Voltage (Vsup): 5.5 V

Can handle slightly higher supply voltage levels, providing a margin of safety.

No. of Outputs: 3

Multiple output channels for powering different components simultaneously.

Adjustable Threshold: YES

Allows for customization of output voltage thresholds to meet specific requirements.

Technical Specifications

Power Management ICs LM10502TLE/NOPB attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PBGA-B25

JESD-609 Code:

e1

Length:

2.46 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Outputs:

3

No. of Terminals:

25

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

1 A

Maximum Output Voltage:

3.6 V

Minimum Output Voltage:

.7 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.675 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Maximum Switching Frequency:

2300 kHz

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.46 mm

Trade Compliance

LM10502TLE/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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