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LM10500SQ-1.0

Texas Instruments

LM10500SQ-1.0 by Texas Instruments

LM10500SQ-1.0 by Texas Instruments is a Power Management IC with 28 terminals, operating b/w -40 to 85°C. It supports supply voltages from 3V to 18V and comes in a square chip carrier package suitable for industrial applications. With a very thin profile and no-lead terminal form, it's ideal for compact power supply support circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,844 parts In-Stock

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5,844

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Digiode

USA . 2,877 parts In-Stock

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2,877

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Distributors (Availability)

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Semicontronic

India . 810 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

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810

$2.500

$2.438

$2.425

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Ampacity Inc.

Singapore . 1,619 parts In-Stock

1+ parts

$3.500

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1,619

$3.500

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One Stop Electronics

USA . 942 parts In-Stock

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$3.500

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942

$3.500

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Parana Technologies

USA . 2,094 parts In-Stock

1+ parts

$5.670

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$6.465

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2,094

$5.670

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$6.465

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DigiPath Technology Company

USA . 1,556 parts In-Stock

1+ parts

$6.244

100+ parts

$5.744

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1,556

$6.244

$5.744

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ChromeModa Solutions

Germany . 6,376 parts In-Stock

1+ parts

$6.371

100+ parts

$5.224

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6,376

$6.371

$5.224

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IDEA Electronic Components Group

UK . 1,210 parts In-Stock

1+ parts

$6.371

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$5.734

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1,210

$6.371

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$5.734

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AZTECH Wire

Italy . 354 parts In-Stock

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$8.744

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354

$8.744

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Corphita

USA . 4,518 parts In-Stock

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4,518

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Corohmni

South Africa . 277 parts In-Stock

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Overview

Upgrade your power management systems with the LM10500SQ-1.0 by Texas Instruments. This high-quality Power Management IC boasts a square package shape, surface mount capability, and a wide supply voltage range. Designed for industrial applications, this chip carrier with heat sink/slug and very thin profile offers exceptional value and benefits for your projects. Trust in Texas Instruments' reputation for reliability and innovation, and experience the advantages of seamless power supply support with the LM10500SQ-1.0.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on a PCB, saving space and reducing assembly time.

Package Shape: SQUARE

Square shape provides a compact footprint, making it ideal for applications where space is limited.

Nominal Supply Voltage (Vsup): 12 V

Compatible with a wide range of 12V systems, making it versatile for different power management applications.

No. of Terminals: 28

Sufficient number of terminals for connecting various components, supporting complex power management functions.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of package styles offers efficient heat dissipation and compact design for improved reliability and performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in extreme cold conditions without compromising functionality.

Terminal Position: QUAD

Quad terminal position facilitates easy connections and enhances signal integrity for efficient power management.

Maximum Seated Height: 0.8 mm

Low profile design enables the product to be used in compact electronic devices or systems.

Width (mm): 5 mm

Narrow width makes it suitable for applications with limited space, offering flexibility in installation.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power supply support, ensuring efficient and stable power delivery in various applications.

Minimum Supply Voltage (Vsup): 3 V

Supports a minimum supply voltage of 3V, making it compatible with a wide range of lower power systems.

Length: 5 mm

Compact length contributes to the overall small form factor of the product, suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and performance in harsh operating conditions found in industrial environments.

Terminal Form: NO LEAD

No-lead terminal form enhances reliability and minimizes the risk of solder joint failure, improving the overall durability of the product.

Terminal Pitch: 0.5 mm

Small terminal pitch allows for high-density mounting and enables more compact designs in power management circuits.

Maximum Supply Voltage (Vsup): 18 V

Supports a maximum supply voltage of 18V, making it suitable for high voltage applications where reliable power management is essential.

Technical Specifications

Power Management ICs LM10500SQ-1.0 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-XQCC-N28

Length:

5 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

5 mm

Trade Compliance

LM10500SQ-1.0 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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