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LM10000SDE/NOPB

Texas Instruments

LM10000SDE/NOPB by Texas Instruments

LM10000SDE/NOPB by Texas Instruments is a Power Management IC with 14 terminals, operating at -40 to 125°C. It supports supply voltages of 3-5.5V and has an adjustable threshold feature. Ideal for automotive applications due to its small size, surface mount capability, and low supply current of 0.41mA.

Median Price

$3.172

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,450 parts In-Stock

1+ parts

$4.202

100+ parts

$3.682

1k+ parts

$2.080

10k+ parts

-

3,450

$4.202

$3.682

$2.080

-

Rochester

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$2.600

1k+ parts

$2.330

10k+ parts

$2.190

9,000

-

$2.600

$2.330

$2.190

DigiKey

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$3.430

1k+ parts

-

10k+ parts

-

9,000

-

$3.430

-

-

Verical

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.913

10k+ parts

$2.737

9,000

-

-

$2.913

$2.737

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,368 parts In-Stock

1+ parts

$2.746

100+ parts

-

1k+ parts

-

10k+ parts

-

3,368

$2.746

-

-

-

Vyrian

USA . 1,526 parts In-Stock

1+ parts

$2.890

100+ parts

-

1k+ parts

-

10k+ parts

-

1,526

$2.890

-

-

-

DigiKey Marketplace

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$3.010

1k+ parts

-

10k+ parts

-

9,000

-

$3.010

-

-

Anansix

USA . 2,547 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,547

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,755 parts In-Stock

1+ parts

$2.601

100+ parts

-

1k+ parts

-

10k+ parts

-

3,755

$2.601

-

-

-

Component Stockers USA

USA . 65,469 parts In-Stock

1+ parts

$2.940

100+ parts

$2.760

1k+ parts

$2.220

10k+ parts

$2.220

65,469

$2.940

$2.760

$2.220

$2.220

Parana Technologies

USA . 358 parts In-Stock

1+ parts

$14.905

100+ parts

-

1k+ parts

$15.331

10k+ parts

-

358

$14.905

-

$15.331

-

ChromeModa Solutions

Germany . 2,890 parts In-Stock

1+ parts

$16.747

100+ parts

$13.733

1k+ parts

-

10k+ parts

-

2,890

$16.747

$13.733

-

-

IDEA Electronic Components Group

UK . 1,482 parts In-Stock

1+ parts

$16.747

100+ parts

$15.910

1k+ parts

$15.072

10k+ parts

-

1,482

$16.747

$15.910

$15.072

-

Microchip USA

USA . 1,797 parts In-Stock

1+ parts

$25.260

100+ parts

$25.110

1k+ parts

$25.030

10k+ parts

$24.950

1,797

$25.260

$25.110

$25.030

$24.950

QUARKTWIN TECHNOLOGY LTD

USA . 9,245 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,245

-

-

-

-

DigiPath Technology Company

USA . 957 parts In-Stock

1+ parts

-

100+ parts

$15.099

1k+ parts

-

10k+ parts

-

957

-

$15.099

-

-

Overview

Power up your applications with the LM10000SDE/NOPB by Texas Instruments, a high-quality Power Management IC designed to deliver top-notch performance and reliability. This versatile device is perfect for a wide range of power supply support circuit applications, offering customers excellent value and benefits. With its small outline package shape, surface mount capability, and adjustable threshold feature, the LM10000SDE/NOPB is the ideal choice for automotive-grade projects that require precision and efficiency. Trust in Texas Instruments to provide you with cutting-edge technology that will take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IC, ensuring long-lasting performance.

Nominal Supply Voltage (Vsup): 5 V

A standard supply voltage of 5V makes this IC compatible with a wide range of applications and power sources.

No. of Terminals: 14

Having a higher number of terminals allows for more versatile connectivity options and integration into complex electronic systems.

Minimum Operating Temperature: -40 °C

The ability to operate in extremely low temperatures makes this IC suitable for automotive and industrial applications where temperature variations are common.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this IC can withstand heat and perform reliably in demanding environmental conditions.

Terminal Finish: MATTE TIN

The matte tin finish provides a reliable and corrosion-resistant connection for the terminals, ensuring stable performance over time.

Technical Specifications

Power Management ICs LM10000SDE/NOPB attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-N14

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC14,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.41 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

LM10000SDE/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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