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LM10500SQX-0.8

Texas Instruments

LM10500SQX-0.8 by Texas Instruments

LM10500SQX-0.8 by Texas Instruments is a Power Management IC with 28 terminals, operating b/w -40 to 85 °C. It supports supply voltages from 3V to 18V and comes in a square chip carrier package. Ideal for industrial applications requiring compact power supply support circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,442 parts In-Stock

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Digiode

USA . 1,329 parts In-Stock

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1,329

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Distributors (Availability)

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Semicontronic

India . 456 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

10k+ parts

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456

$2.500

$2.438

$2.425

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AZTECH Wire

Italy . 641 parts In-Stock

1+ parts

$4.979

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641

$4.979

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One Stop Electronics

USA . 780 parts In-Stock

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$5.500

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780

$5.500

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Ampacity Inc.

Singapore . 1,250 parts In-Stock

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$6.500

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1,250

$6.500

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Parana Technologies

USA . 610 parts In-Stock

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$15.471

100+ parts

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$15.854

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610

$15.471

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$15.854

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DigiPath Technology Company

USA . 3 parts In-Stock

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$17.035

100+ parts

$15.673

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3

$17.035

$15.673

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ChromeModa Solutions

Germany . 5,130 parts In-Stock

1+ parts

$17.383

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$14.254

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$17.383

$14.254

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IDEA Electronic Components Group

UK . 1,382 parts In-Stock

1+ parts

$17.383

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$16.514

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$15.645

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1,382

$17.383

$16.514

$15.645

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 605 parts In-Stock

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605

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Corohmni

South Africa . 425 parts In-Stock

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425

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Overview

Elevate your power management solutions with the LM10500SQX-0.8 by Texas Instruments. This cutting-edge Power Management IC offers unparalleled quality and reliability, backed by the trusted name of Texas Instruments. Ideal for a wide range of applications, this product provides customers with enhanced performance, efficiency, and peace of mind. Experience the value and benefits of superior power management technology with the LM10500SQX-0.8.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation on printed circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape is compact and can easily fit into tight spaces, making it ideal for smaller electronic devices.

Nominal Supply Voltage (Vsup): 12 V

Suitable for applications where a stable 12V power source is required, ensuring compatibility with a wide range of devices.

No. of Terminals: 28

With 28 terminals, this power management IC offers ample connectivity options for various inputs and outputs, making it versatile for different applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles provides efficient heat dissipation and space-saving design for effective power management.

Maximum Operating Temperature: 85 °C

Capable of operating at higher temperatures, making it suitable for industrial applications where heat may be a concern.

Minimum Operating Temperature: -40 °C

Designed to withstand low temperatures, enhancing the product's reliability and performance in harsh environments.

Terminal Position: QUAD

Quad terminal position ensures stable connections and reduces the risk of signal interference, improving overall performance.

Maximum Seated Height: 0.8 mm

Low seated height allows for a compact overall design, which can be beneficial for space-constrained applications.

Width (mm): 5 mm

Compact width of 5mm makes this power management IC suitable for small electronic devices where space is limited.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed to support power supply circuits, making it a reliable choice for managing and regulating power in electronic systems.

Minimum Supply Voltage (Vsup): 3 V

Capable of operating with as low as 3V supply voltage, providing flexibility in power input options for various applications.

Length: 5 mm

Compact length of 5mm contributes to the overall small form factor of this power management IC, making it suitable for compact electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environmental conditions commonly found in industrial settings.

Terminal Form: NO LEAD

No-lead terminal form offers improved reliability and durability, reducing the risk of solder joint failures in high-stress applications.

Terminal Pitch: 0.5 mm

With a fine terminal pitch of 0.5mm, this power management IC enables high-density mounting on PCBs, maximizing space utilization.

Maximum Supply Voltage (Vsup): 18 V

Supports a maximum supply voltage of 18V, providing compatibility with various power sources and devices that require higher voltage levels.

Technical Specifications

Power Management ICs LM10500SQX-0.8 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-XQCC-N28

Length:

5 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

5 mm

Trade Compliance

LM10500SQX-0.8 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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