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JM38510/37501BCA

Texas Instruments

JM38510/37501BCA by Texas Instruments

JM38510/37501BCA by Texas Instruments is a MILITARY-grade TTL Logic Gates IC with 4 functions, 2 inputs, and 18ns propagation delay at 5V. It comes in a CERAMIC package with DUAL terminals suitable for applications requiring fast signal processing in harsh environments.

Median Price

$21.800

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

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Rochester

USA . 102 parts In-Stock

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$21.800

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$19.510

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$18.360

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DigiKey

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Verical

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$22.950

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Avnet

USA . 17 parts In-Stock

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Freelance Electronics

USA . 233 parts In-Stock

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$6.447

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Digiode

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American Microsemiconductor Inc.

USA . 1,500 parts In-Stock

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$19.950

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Vyrian

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Electronic Expediters

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Bristol Electronics

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Atlantic Semiconductor

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Mil-Aero Solutions, Inc.

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Resion

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Manoshevitz Elec. Sales

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Microfarads

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Legend Electronics Inc.

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Odi Ramu Company

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Inland Empire Components Inc.

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Electronics Depot

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North Shore Components

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Corel Iberica Componentes, S.L.

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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R&J Components

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PC Components Company LLC

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MISTER SPROCKETS

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Ampacity Inc.

Singapore . 39 parts In-Stock

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$15.780

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Parana Technologies

USA . 616 parts In-Stock

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DigiPath Technology Company

USA . 175 parts In-Stock

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ChromeModa Solutions

Germany . 4,032 parts In-Stock

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IDEA Electronic Components Group

UK . 200 parts In-Stock

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Corphita

USA . 799 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 19,144 parts In-Stock

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Microchip USA

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Assy Fe

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Overview

Unleash the power of cutting-edge technology with the JM38510/37501BCA Logic Gates by Texas Instruments. Crafted with precision and expertise, this product is designed to elevate your projects to new heights. Ideal for military-grade applications, this logic gate offers unbeatable reliability and performance. With a wide range of functions and low propagation delay, you can trust this device to deliver seamless operation every time. Say goodbye to subpar components and welcome excellence into your work with Texas Instruments' top-of-the-line logic gates. Elevate your projects and exceed expectations with the JM38510/37501BCA.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and reliability, making it suitable for harsh environments.

Propagation Delay At Nominal Supply: 18 ns

Fast propagation delay ensures quick processing of signals.

No. of Functions: 4

Can perform multiple logic functions in a single component, saving space and simplifying circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common supply voltage, making it compatible with standard systems.

Minimum Operating Temperature: -55 °C

Works reliably in extreme cold temperatures, suitable for various applications.

Technology: TTL

Uses TTL technology known for its high speed and reliability in logic operations.

Technical Specifications

Logic Gates JM38510/37501BCA attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

.4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

4.9 mA

Propagation Delay At Nominal Supply:

18 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

JM38510/37501BCA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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