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JM38510/37204B2A

Texas Instruments

JM38510/37204B2A by Texas Instruments

JM38510/37204B2A by Texas Instruments is an 8-bit bus driver with a supply voltage of 5V and 50pF load capacitance. It operates in military-grade temperature range, featuring a propagation delay of 17ns and max current of 31mA. Ideal for applications requiring true output polarity and positive edge trigger type in a compact chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,657 parts In-Stock

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Digiode

USA . 3,509 parts In-Stock

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EPE Components Inc.

USA . 55 parts In-Stock

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Bristol Electronics

USA . 55 parts In-Stock

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Electronic Expediters

USA . 23 parts In-Stock

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AZTECH Wire

Italy . 895 parts In-Stock

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$7.948

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895

$7.948

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Parana Technologies

USA . 1,541 parts In-Stock

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$24.398

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$2,265.767

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$21.959

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$2,265.767

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Ampacity Inc.

Singapore . 831 parts In-Stock

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$25.000

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$25.000

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DigiPath Technology Company

USA . 184 parts In-Stock

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$26.866

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$24.716

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ChromeModa Solutions

Germany . 3,328 parts In-Stock

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$27.414

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$22.479

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$27.414

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IDEA Electronic Components Group

UK . 1,620 parts In-Stock

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$27.414

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$26.043

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$24.673

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One Stop Electronics

USA . 188 parts In-Stock

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Corphita

USA . 4,121 parts In-Stock

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Microchip USA

USA . 1,150 parts In-Stock

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Overview

Unleash the power of Texas Instruments with the JM38510/37204B2A Bus Driver & Transceivers. This high-quality product boasts a MILITARY-grade screening level, ensuring reliability and durability for your applications. With a true output polarity and 3-STATE output characteristics, this chip carrier offers a seamless integration into your designs. Experience the benefits of fast propagation delay and a wide operating temperature range, making it perfect for demanding environments. Trust in Texas Instruments to deliver cutting-edge technology that drives performance and efficiency in your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making this product suitable for harsh environments.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Screening Level: MIL-M-38510 Class B

Meets military standards for quality and reliability, ensuring consistent performance in demanding applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with a wide range of systems.

Propagation Delay (tpd): 17 ns

Provides fast signal processing, reducing latency and improving overall system performance.

Temperature Grade: MILITARY

Designed to withstand extreme temperature conditions, making it ideal for aerospace and defense applications.

Technology: TTL

Utilizes TTL technology for reliable and efficient signal transmission, ensuring accurate data communication.

Technical Specifications

Bus Driver & Transceivers JM38510/37204B2A attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Maximum Power Supply Current (ICC):

31 mA

Propagation Delay (tpd):

17 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trigger Type:

POSITIVE EDGE

Width:

8.89 mm

Trade Compliance

JM38510/37204B2A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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