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JM38510/07105BFA

Texas Instruments

JM38510/07105BFA by Texas Instruments

JM38510/07105BFA by Texas Instruments is a 6-bit TTL latch with 17ns propagation delay. Operating b/w -55 to 125°C, it has a max frequency of 75MHz and can handle up to 144mA current. Ideal for military applications requiring fast data processing in harsh environments.

Median Price

$13.173

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 37 parts In-Stock

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$13.173

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$13.832

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$13.041

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Digiode

USA . 4,605 parts In-Stock

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Vyrian

USA . 2,640 parts In-Stock

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Lighthouse Electronics, Inc.

USA . 2,240 parts In-Stock

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Resion

USA . 508 parts In-Stock

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Electronic Expediters

USA . 87 parts In-Stock

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Q Components

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Mil-Aero Solutions, Inc.

USA . 16 parts In-Stock

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Sunrise Surplus Inc.

USA . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 236 parts In-Stock

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$5.054

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Parana Technologies

USA . 204 parts In-Stock

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$11.758

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$12.158

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DigiPath Technology Company

USA . 1,464 parts In-Stock

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$12.947

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$11.911

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ChromeModa Solutions

Germany . 2,641 parts In-Stock

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$13.211

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$10.833

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IDEA Electronic Components Group

UK . 558 parts In-Stock

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$13.211

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$12.550

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$11.890

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One Stop Electronics

USA . 1,649 parts In-Stock

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Corphita

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Microchip USA

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Overview

Elevate your circuit designs with the JM38510/07105BFA by Texas Instruments. Crafted with precision in a MIL-M-38510 Class B screening level, this latches & flip-flops device offers rapid 17ns propagation delay for seamless performance. Ideal for military-grade applications, this rectangular-shaped package is surface mountable for convenient integration. Experience the superior quality and reliability of Texas Instruments while unlocking endless possibilities for your projects. Trust in the unmatched value and benefits that this product delivers to enhance your electronics endeavors.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Durable and reliable material that protects the internal components of the latch or flip-flop, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 17 ns

Fast propagation delay facilitates quick switching operations, making this product suitable for applications requiring high-speed data processing.

Surface Mount: YES

Easily mountable on PCBs, simplifying the assembly process and saving space in electronic devices.

Technology: TTL

Uses TTL technology, known for its high speed and reliability, making this latch or flip-flop a dependable choice for various electronic applications.

Maximum Frequency At Nominal Supply: 75,000,000 Hz

Capable of handling high-frequency signals, making it suitable for applications that require fast data processing and communication.

Technical Specifications

Latches & Flip-Flops JM38510/07105BFA attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

S

JESD-30 Code:

R-GDFP-F16

JESD-609 Code:

e0

Length:

10.16 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

75000000 Hz

Maximum I (ol):

20 Amp

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

144 mA

Propagation Delay At Nominal Supply:

17 ns

Propagation Delay (tpd):

17 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

6.73 mm

Minimum fmax:

75 MHz

Trade Compliance

JM38510/07105BFA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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