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ISO7841FDW

Texas Instruments

ISO7841FDW by Texas Instruments

ISO7841FDW by Texas Instruments is a digital isolator with 4 channels, operating at -55 to 125 °C. It has a supply voltage range of 2.25-5.5 V and comes in a small outline package suitable for military-grade applications. The IC features CMOS technology, Gull Wing terminals, and nickel palladium gold finish for robust performance in harsh environments.

Median Price

$10.520

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,285 parts In-Stock

1+ parts

$9.417

100+ parts

$8.252

1k+ parts

$4.662

10k+ parts

-

2,285

$9.417

$8.252

$4.662

-

Mouser Electronics

USA . 51 parts In-Stock

1+ parts

$10.520

100+ parts

$9.660

1k+ parts

$7.730

10k+ parts

-

51

$10.520

$9.660

$7.730

-

DigiKey

USA . 1 parts In-Stock

1+ parts

$10.520

100+ parts

-

1k+ parts

-

10k+ parts

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1

$10.520

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$8.796

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$8.796

-

-

-

Digiode

USA . 3,600 parts In-Stock

1+ parts

$8.946

100+ parts

-

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-

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3,600

$8.946

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-

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Vyrian

USA . 7,008 parts In-Stock

1+ parts

-

100+ parts

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7,008

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,679 parts In-Stock

1+ parts

$6.136

100+ parts

$569.789

1k+ parts

$5.522

10k+ parts

-

1,679

$6.136

$569.789

$5.522

-

DigiPath Technology Company

USA . 1,344 parts In-Stock

1+ parts

$6.756

100+ parts

$6.216

1k+ parts

-

10k+ parts

-

1,344

$6.756

$6.216

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-

ChromeModa Solutions

Germany . 2,387 parts In-Stock

1+ parts

$6.894

100+ parts

$5.653

1k+ parts

-

10k+ parts

-

2,387

$6.894

$5.653

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-

IDEA Electronic Components Group

UK . 6 parts In-Stock

1+ parts

$6.894

100+ parts

-

1k+ parts

$6.205

10k+ parts

-

6

$6.894

-

$6.205

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Semicontronic

India . 971 parts In-Stock

1+ parts

$8.000

100+ parts

$7.800

1k+ parts

$7.760

10k+ parts

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971

$8.000

$7.800

$7.760

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Ampacity Inc.

Singapore . 815 parts In-Stock

1+ parts

$8.000

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815

$8.000

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Corphita

USA . 2,698 parts In-Stock

1+ parts

$8.475

100+ parts

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10k+ parts

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2,698

$8.475

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Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$8.796

100+ parts

$8.356

1k+ parts

-

10k+ parts

$7.828

300

$8.796

$8.356

-

$7.828

Continental Prestige Electronics

USA . 3,220 parts In-Stock

1+ parts

$8.796

100+ parts

-

1k+ parts

-

10k+ parts

$8.620

3,220

$8.796

-

-

$8.620

Advanced Electronics

New Zealand . 268 parts In-Stock

1+ parts

$8.972

100+ parts

$8.972

1k+ parts

$8.972

10k+ parts

-

268

$8.972

$8.972

$8.972

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Corohmni

South Africa . 467 parts In-Stock

1+ parts

$14.602

100+ parts

-

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467

$14.602

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Argo Parts USA

USA . 3,987 parts In-Stock

1+ parts

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3,987

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Overview

Experience unparalleled quality and reliability with the Texas Instruments ISO7841FDW. As a leader in innovative technology, Texas Instruments delivers cutting-edge solutions that meet the highest standards of excellence. The ISO7841FDW, part of the Other Function Interface ICs category, offers customers unmatched value and benefits. With its advanced features and applications, this product provides seamless integration and improved performance for a wide range of electronic devices. Trust Texas Instruments to provide you with the best in class solutions for your technology needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the IC durable and resistant to external damage.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort.

Maximum Supply Voltage: 5.5 V

Can operate at high supply voltages, providing flexibility in different circuit designs.

No. of Functions: 4

Offers multiple functions in a single IC, reducing the need for additional components and simplifying the circuit design.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on a PCB and saves space.

No. of Terminals: 16

Sufficient number of terminals for connectivity with other components in the circuit.

Maximum Operating Temperature: 125 °C

Can operate at high temperatures, suitable for a wide range of applications.

Minimum Operating Temperature: -55 °C

Can operate at low temperatures, making it suitable for harsh environments.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Nominal Supply Voltage: 2.5 V

Operates at a commonly used supply voltage, compatible with many systems.

Technical Specifications

Other Function Interface ICs ISO7841FDW attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 3.3, 5 V

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7841FDW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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