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ISO7830FDWWR

Texas Instruments

ISO7830FDWWR by Texas Instruments

ISO7830FDWWR by Texas Instruments is a 16-terminal IC with 3 functions, operating b/w -55 to 125 °C. It features CMOS technology, MILITARY grade, and supports 2.25-5.5 V supply voltage range. Ideal for interface circuits in applications requiring small outline packages and surface mount compatibility.

Median Price

$4.946

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 25 parts In-Stock

1+ parts

$3.680

100+ parts

$3.167

1k+ parts

-

10k+ parts

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25

$3.680

$3.167

-

-

Verical

USA . 282 parts In-Stock

1+ parts

$3.970

100+ parts

$3.766

1k+ parts

-

10k+ parts

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282

$3.970

$3.766

-

-

Arrow

USA . 25 parts In-Stock

1+ parts

$4.152

100+ parts

$3.032

1k+ parts

-

10k+ parts

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25

$4.152

$3.032

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Texas Instruments

USA . 14,000 parts In-Stock

1+ parts

$5.741

100+ parts

$5.030

1k+ parts

$2.842

10k+ parts

-

14,000

$5.741

$5.030

$2.842

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Farnell

UK . 1,000 parts In-Stock

1+ parts

$6.880

100+ parts

$4.910

1k+ parts

$3.700

10k+ parts

-

1,000

$6.880

$4.910

$3.700

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Element14

Singapore . 1,000 parts In-Stock

1+ parts

$14.660

100+ parts

$10.980

1k+ parts

$9.560

10k+ parts

-

1,000

$14.660

$10.980

$9.560

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,769 parts In-Stock

1+ parts

$3.496

100+ parts

-

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1,769

$3.496

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Vyrian

USA . 3,404 parts In-Stock

1+ parts

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3,404

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 865 parts In-Stock

1+ parts

$3.186

100+ parts

-

1k+ parts

$3.708

10k+ parts

-

865

$3.186

-

$3.708

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Corphita

USA . 2,849 parts In-Stock

1+ parts

$3.312

100+ parts

-

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2,849

$3.312

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DigiPath Technology Company

USA . 2,265 parts In-Stock

1+ parts

$3.508

100+ parts

$3.228

1k+ parts

-

10k+ parts

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2,265

$3.508

$3.228

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IDEA Electronic Components Group

UK . 1,332 parts In-Stock

1+ parts

$3.580

100+ parts

-

1k+ parts

$3.222

10k+ parts

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1,332

$3.580

-

$3.222

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ChromeModa Solutions

Germany . 1,060 parts In-Stock

1+ parts

$3.580

100+ parts

$2.936

1k+ parts

-

10k+ parts

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1,060

$3.580

$2.936

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Continental Prestige Electronics

USA . 1,000 parts In-Stock

1+ parts

$6.880

100+ parts

$4.910

1k+ parts

-

10k+ parts

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1,000

$6.880

$4.910

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AZTECH Wire

Italy . 874 parts In-Stock

1+ parts

$17.700

100+ parts

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874

$17.700

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Perfect Parts

USA . 2,240 parts In-Stock

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2,240

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Overview

Elevate your electronic designs with the Texas Instruments ISO7830FDWWR, a top-of-the-line Other Function Interface IC that boasts unparalleled quality and reliability. With a MILITARY-grade temperature rating and CMOS technology, this interface circuit offers three channels of seamless connectivity in a compact, surface-mount package. Whether you're designing industrial controls or automotive applications, this IC delivers exceptional performance and peace of mind. Trust Texas Instruments to provide cutting-edge solutions for your engineering needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is durable and provides good protection for the IC, ensuring its longevity.

Surface Mount: YES

Being surface mountable makes it easier to integrate this IC into circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in the power supply arrangements for the IC.

No. of Functions: 3

With 3 functions in a single package, this IC provides multiple capabilities in a compact form factor.

Package Shape: RECTANGULAR

The rectangular shape is commonly used and makes it easier to design circuits around this IC.

No. of Terminals: 16

Having 16 terminals allows for connection to multiple external components, expanding the possibilities for usage.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and is suitable for compact designs.

Minimum Supply Voltage: 2.25 V

The low minimum supply voltage allows for operation in a wider range of power supply conditions.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in harsh environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows for use in extreme cold conditions without compromising functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides good conductivity and prevents corrosion of the terminals, ensuring reliable connections.

Terminal Position: DUAL

The dual terminal position allows for versatility in mounting and connection options.

Maximum Seated Height: 2.65 mm

The low maximum seated height makes this IC suitable for applications where space is limited.

Width: 10.3 mm

The compact width of 10.3 mm ensures that this IC can fit into tight spaces on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, this IC can be efficiently soldered onto the circuit board.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering and reliable connections.

Length: 14 mm

The compact length of 14 mm allows for flexible placement of this IC on the circuit board.

Temperature Grade: MILITARY

The military-grade temperature tolerance makes this IC suitable for rugged applications and harsh environments.

No. of Channels: 3

With 3 channels, this IC can handle multiple input or output signals simultaneously.

Technology: CMOS

The CMOS technology used in this IC provides low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull-wing terminal form allows for easy surface mounting and reliable connections.

Nominal Supply Voltage: 2.5 V

The 2.5 V nominal supply voltage is a standard value that is commonly used in many applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is a common spacing that facilitates easy and secure soldering of the terminals.

Moisture Sensitivity Level (MSL): 2

With an MSL of 2, this IC can withstand moderate levels of moisture exposure during storage and handling.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, this product facilitates communication between different components in a system, making it a versatile choice for various applications.

Technical Specifications

Other Function Interface ICs ISO7830FDWWR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

3

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.3 mm

Trade Compliance

ISO7830FDWWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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