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ISO7763FDWR

Texas Instruments

ISO7763FDWR by Texas Instruments

ISO7763FDWR by Texas Instruments is a CMOS interface IC with 6 functions, operating b/w -55 to 125 °C. It has a supply voltage range of 2.25-5.5 V and comes in a small outline package suitable for military-grade applications. The terminal finish is Ni/Pd/Au, making it ideal for surface mount designs requiring high reliability.

Median Price

$3.670

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 54,984 parts In-Stock

1+ parts

$2.028

100+ parts

$1.777

1k+ parts

$1.004

10k+ parts

-

54,984

$2.028

$1.777

$1.004

-

DigiKey

USA . 1,537 parts In-Stock

1+ parts

$3.670

100+ parts

$2.294

1k+ parts

$2.045

10k+ parts

$1.957

1,537

$3.670

$2.294

$2.045

$1.957

Mouser Electronics

USA . 1,246 parts In-Stock

1+ parts

$3.670

100+ parts

$2.300

1k+ parts

$2.050

10k+ parts

$1.950

1,246

$3.670

$2.300

$2.050

$1.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 43 parts In-Stock

1+ parts

$1.776

100+ parts

-

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-

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43

$1.776

-

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Digiode

USA . 2,002 parts In-Stock

1+ parts

$1.927

100+ parts

-

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2,002

$1.927

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-

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Vyrian

USA . 4,011 parts In-Stock

1+ parts

-

100+ parts

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4,011

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Chip Stock

USA . 3,000 parts In-Stock

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3,000

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LIBRA Elektronik GmbH

Germany . 2,423 parts In-Stock

1+ parts

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2,423

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 28,055 parts In-Stock

1+ parts

$1.720

100+ parts

-

1k+ parts

-

10k+ parts

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28,055

$1.720

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-

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Argo Parts USA

USA . 4,924 parts In-Stock

1+ parts

$1.776

100+ parts

-

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4,924

$1.776

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Continental Prestige Electronics

USA . 73 parts In-Stock

1+ parts

$1.776

100+ parts

-

1k+ parts

-

10k+ parts

$1.740

73

$1.776

-

-

$1.740

Corphita

USA . 1,819 parts In-Stock

1+ parts

$1.825

100+ parts

-

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1,819

$1.825

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Parana Technologies

USA . 447 parts In-Stock

1+ parts

$7.399

100+ parts

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$7.889

10k+ parts

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447

$7.399

-

$7.889

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DigiPath Technology Company

USA . 1,402 parts In-Stock

1+ parts

$8.147

100+ parts

$7.495

1k+ parts

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1,402

$8.147

$7.495

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ChromeModa Solutions

Germany . 6,196 parts In-Stock

1+ parts

$8.313

100+ parts

$6.817

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6,196

$8.313

$6.817

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IDEA Electronic Components Group

UK . 782 parts In-Stock

1+ parts

$8.313

100+ parts

$7.897

1k+ parts

$7.482

10k+ parts

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782

$8.313

$7.897

$7.482

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Corohmni

South Africa . 426 parts In-Stock

1+ parts

$11.690

100+ parts

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426

$11.690

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AZTECH Wire

Italy . 1,128 parts In-Stock

1+ parts

$15.030

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1,128

$15.030

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Perfect Parts

USA . 1,904 parts In-Stock

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1,904

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$1.740

1k+ parts

$1.687

10k+ parts

$1.652

500

-

$1.740

$1.687

$1.652

Lixinc

USA . 24 parts In-Stock

1+ parts

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24

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Overview

Enhance your electronic designs with the ISO7763FDWR from Texas Instruments, a leading manufacturer known for reliability and innovation. This versatile Interface IC offers 6 functions in a compact package, making it ideal for a wide range of applications. With a wide supply voltage range and military-grade temperature tolerance, this product provides exceptional value and performance. Trust Texas Instruments to deliver top-notch quality and cutting-edge technology for all your interface circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly of electronic circuits.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can be used in a wide range of applications.

No. of Functions: 6

Having 6 functions in one IC saves space on the PCB and reduces overall component count.

Package Shape: RECTANGULAR

The rectangular package shape simplifies the design and layout of the circuit board.

No. of Terminals: 16

With 16 terminals, this IC can provide multiple connection points for increased versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact designs.

Minimum Supply Voltage: 2.25 V

The low minimum supply voltage allows for efficient operation in low-power applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in harsh environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature makes this product suitable for a wide range of operating conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position enhances stability and connectivity of the IC.

Maximum Seated Height: 2.65 mm

The low maximum seated height allows for more compact and streamlined designs.

Width: 7.5 mm

The narrow width of the IC ensures compatibility with various circuit board layouts.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering during assembly.

Length: 10.3 mm

The compact length of the IC saves space and allows for more flexibility in design.

Temperature Grade: MILITARY

The military-grade temperature rating guarantees reliable operation in extreme conditions.

No. of Channels: 6

With 6 channels, this IC can handle multiple input and output signals efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this IC energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form provides secure mounting and reliable connections.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V ensures stable and efficient operation.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for denser packing of components on the PCB.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates that this product has a moderate level of sensitivity to moisture, ensuring reliability during storage and assembly.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit, this IC facilitates communication between different electronic devices, making it a versatile and essential component.

Technical Specifications

Other Function Interface ICs ISO7763FDWR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

6

No. of Functions:

6

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

ISO7763FDWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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