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ISO7340CDW

Texas Instruments

ISO7340CDW by Texas Instruments

ISO7340CDW by Texas Instruments is a 16-terminal IC with 4 functions, operating b/w -40 to 125 °C. It has a supply voltage range of 3.3V to 5V and is suitable for automotive applications due to its small outline package and dual terminal position. The interface circuit supports up to 4 channels with a moisture sensitivity level of MSL2.

Median Price

$8.959

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 50 parts In-Stock

1+ parts

$3.880

100+ parts

$2.350

1k+ parts

-

10k+ parts

-

50

$3.880

$2.350

-

-

Texas Instruments

USA . 22,562 parts In-Stock

1+ parts

$4.858

100+ parts

$4.257

1k+ parts

$2.405

10k+ parts

-

22,562

$4.858

$4.257

$2.405

-

DigiKey

USA . 820 parts In-Stock

1+ parts

$13.060

100+ parts

$9.290

1k+ parts

$8.055

10k+ parts

-

820

$13.060

$9.290

$8.055

-

Mouser Electronics

USA . 53 parts In-Stock

1+ parts

$15.170

100+ parts

$11.050

1k+ parts

$8.220

10k+ parts

-

53

$15.170

$11.050

$8.220

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 725 parts In-Stock

1+ parts

$2.850

100+ parts

-

1k+ parts

-

10k+ parts

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725

$2.850

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-

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Vyrian

USA . 6,775 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,775

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 994 parts In-Stock

1+ parts

$2.194

100+ parts

-

1k+ parts

$2.704

10k+ parts

-

994

$2.194

-

$2.704

-

DigiPath Technology Company

USA . 1,203 parts In-Stock

1+ parts

$2.416

100+ parts

$2.222

1k+ parts

-

10k+ parts

-

1,203

$2.416

$2.222

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-

ChromeModa Solutions

Germany . 5,020 parts In-Stock

1+ parts

$2.465

100+ parts

$2.021

1k+ parts

-

10k+ parts

-

5,020

$2.465

$2.021

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-

IDEA Electronic Components Group

UK . 79 parts In-Stock

1+ parts

$2.465

100+ parts

-

1k+ parts

$2.218

10k+ parts

-

79

$2.465

-

$2.218

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Corphita

USA . 1,144 parts In-Stock

1+ parts

$2.700

100+ parts

-

1k+ parts

-

10k+ parts

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1,144

$2.700

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-

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Lixinc

USA . 10,407 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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10,407

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-

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,000

-

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Overview

Experience unparalleled quality and reliability with the ISO7340CDW by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch products like this one, designed for a wide range of applications in the category of Other Function Interface ICs. Customers can trust in the value, benefits, and advantages that come with choosing this product, from its high-quality materials to its innovative design. Trust Texas Instruments to provide you with the cutting-edge technology you need for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the IC, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 5 V

With a maximum supply voltage of 5V, this IC can be used in a wide range of systems without the risk of exceeding voltage limits.

No. of Functions: 4

Having 4 functions in a single IC can help simplify circuit design and save space on the PCB, making it a cost-effective solution.

Package Shape: RECTANGULAR

The rectangular package shape is typically easy to handle and mount on PCBs, ensuring compatibility with standard manufacturing processes.

No. of Terminals: 16

With 16 terminals, this IC offers a sufficient number of connections for its functions, providing flexibility in interfacing with other components.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps save space on the PCB and can contribute to a more compact overall system design.

Minimum Supply Voltage: 3.3 V

The minimum supply voltage of 3.3V allows for operation in lower power systems, enhancing energy efficiency and reducing heat generation.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this IC can withstand elevated temperatures, making it suitable for demanding environments.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures reliable performance even in cold conditions, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides good conductivity and corrosion resistance, ensuring long-term reliability of connections.

Terminal Position: DUAL

Dual terminal position offers redundancy and improved reliability in connection, reducing the risk of signal loss or interruption.

Maximum Seated Height: 2.65 mm

The maximum seated height of 2.65mm allows for a compact overall profile, minimizing interference with other components on the PCB.

Width: 7.5 mm

The width of 7.5mm contributes to the compact size of the IC, facilitating space-saving designs in electronic systems.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliable connections during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for effective soldering without damaging the IC, ensuring a robust manufacturing process.

Length: 10.3 mm

The length of 10.3mm contributes to the overall compact size of the IC, making it suitable for space-constrained applications.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates that this IC can withstand harsh automotive environments, making it suitable for automotive electronics applications.

No. of Channels: 4

Having 4 channels allows for multiple input and output connections, enabling versatile use in complex circuitry and communication systems.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and secure connections during assembly and operation, ensuring reliable performance.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is commonly used in many electronic systems, ensuring compatibility and ease of integration.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, this IC allows for precise and efficient connections on the PCB, enabling high-density packaging.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates that this IC has a moderate sensitivity to moisture, making it suitable for standard manufacturing and storage conditions.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, this product facilitates communication and data transfer between different components, enabling seamless operation in integrated systems.

Technical Specifications

Other Function Interface ICs ISO7340CDW attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 5 V

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7340CDW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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