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ISO7320FCQDQ1

Texas Instruments

ISO7320FCQDQ1 by Texas Instruments

ISO7320FCQDQ1 by Texas Instruments is a dual-function interface IC with 2 channels. It operates b/w -40 to 125 °C and has a supply voltage range of 3.3V to 5V, making it suitable for automotive applications. The package style is small outline with gull wing terminals, ideal for surface mount assembly in compact designs.

Median Price

$7.720

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,431 parts In-Stock

1+ parts

$3.424

100+ parts

$3.000

1k+ parts

$1.695

10k+ parts

-

2,431

$3.424

$3.000

$1.695

-

DigiKey

USA . 257 parts In-Stock

1+ parts

$9.950

100+ parts

$6.722

1k+ parts

$6.480

10k+ parts

-

257

$9.950

$6.722

$6.480

-

Mouser Electronics

USA . 200 parts In-Stock

1+ parts

$9.950

100+ parts

$6.470

1k+ parts

$6.460

10k+ parts

$6.020

200

$9.950

$6.470

$6.460

$6.020

Rochester

USA . 5 parts In-Stock

1+ parts

-

100+ parts

$5.490

1k+ parts

$4.910

10k+ parts

$4.620

5

-

$5.490

$4.910

$4.620

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,501 parts In-Stock

1+ parts

$2.232

100+ parts

-

1k+ parts

-

10k+ parts

-

2,501

$2.232

-

-

-

Vyrian

USA . 9,762 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,762

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 686 parts In-Stock

1+ parts

$2.041

100+ parts

-

1k+ parts

$2.564

10k+ parts

-

686

$2.041

-

$2.564

-

Corphita

USA . 3,636 parts In-Stock

1+ parts

$2.115

100+ parts

-

1k+ parts

-

10k+ parts

-

3,636

$2.115

-

-

-

DigiPath Technology Company

USA . 365 parts In-Stock

1+ parts

$2.247

100+ parts

-

1k+ parts

-

10k+ parts

-

365

$2.247

-

-

-

IDEA Electronic Components Group

UK . 688 parts In-Stock

1+ parts

$2.293

100+ parts

-

1k+ parts

$2.064

10k+ parts

-

688

$2.293

-

$2.064

-

ChromeModa Solutions

Germany . 49 parts In-Stock

1+ parts

$2.293

100+ parts

$1.880

1k+ parts

-

10k+ parts

-

49

$2.293

$1.880

-

-

iodParts Technologies Inc.

India . 12,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,500

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

-

-

-

-

Kepictronics

USA . 1,420 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,420

-

-

-

-

Overview

Unlock the power of reliable interface circuits with the Texas Instruments ISO7320FCQDQ1. Designed with precision and quality in mind, this product offers a seamless solution for various applications in automotive settings and beyond. With its advanced features and durable construction, this device ensures smooth operation and unparalleled performance. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations and provides value to customers seeking top-notch solutions. Elevate your projects with the ISO7320FCQDQ1 and experience excellence like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Facilitates easy installation onto circuit boards, making integration into electronic systems efficient.

Maximum Supply Voltage: 5 V

Allows for compatibility with a wide range of electronic devices and systems that operate within this voltage range.

No. of Functions: 2

Provides versatility and capability for multiple functions within a single IC, increasing the efficiency of the product.

Screening Level: AEC-Q100

Ensures high reliability and quality standards, making the product suitable for automotive applications where performance is critical.

Package Shape: RECTANGULAR

Facilitates easy placement and alignment on circuit boards, optimizing space utilization.

No. of Terminals: 8

Allows for multiple connection points, enabling the IC to interface with other components effectively.

Package Style (Meter): SMALL OUTLINE

Compact design saves space and allows for efficient integration into electronic systems with limited space.

Minimum Supply Voltage: 3.3 V

Supports operation with lower power requirements, contributing to energy efficiency and reducing heat generation.

Maximum Operating Temperature: 125 °C

Can withstand high temperature environments, making it suitable for a wide range of operating conditions.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold environments, ensuring reliability in varied temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, enhancing the reliability and performance of the product.

Terminal Position: DUAL

Enables efficient signal transfer and connectivity, enhancing the overall functionality of the product.

Maximum Seated Height: 1.75 mm

Low profile design allows for compact placement within electronic systems, optimizing space usage.

Width: 3.895 mm

Compact width enables flexibility in placement and layout on circuit boards, improving design efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for controlled heating during soldering processes, ensuring reliable connections without damaging the IC.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during soldering, ensuring proper bonding to circuit boards.

Length: 4.905 mm

Optimal length for compatibility with standard electronic components and PCB layouts, facilitating easy integration.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature tolerance and reliability, making it ideal for automotive applications.

No. of Channels: 2

Supports dual-channel communication or functionality, increasing the versatility and performance capabilities of the product.

Terminal Form: GULL WING

Facilitates easy soldering to circuit boards, ensuring secure connections for long-term reliability.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for compatibility with a wide range of electronic systems, ensuring versatile application possibilities.

Terminal Pitch: 1.27 mm

Optimal pitch for efficient connectivity and signal transfer between the IC and other components, enhancing overall performance.

Moisture Sensitivity Level (MSL): 2

Designed to withstand moderate levels of moisture exposure, ensuring reliability in varied environmental conditions.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interfacing between different components or systems, providing essential functionality for diverse applications.

Technical Specifications

Other Function Interface ICs ISO7320FCQDQ1 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 5 V

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

ISO7320FCQDQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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