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ISO7221BDRG4

Texas Instruments

ISO7221BDRG4 by Texas Instruments

ISO7221BDRG4 by Texas Instruments is an 8-terminal interface IC with a supply voltage range of 3.3V to 5V. It operates in temperatures from -40°C to 125°C, making it suitable for automotive applications. This CMOS technology chip has dual terminals and a small outline package style, ideal for surface mount designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 28,350 parts In-Stock

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Vyrian

USA . 4,277 parts In-Stock

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Digiode

USA . 4,185 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Corohmni

South Africa . 908 parts In-Stock

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$4.608

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908

$4.608

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Ampacity Inc.

Singapore . 1,565 parts In-Stock

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$12.500

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$12.500

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Parana Technologies

USA . 1,624 parts In-Stock

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$12.796

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$13.262

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ChromeModa Solutions

Germany . 3,156 parts In-Stock

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$14.377

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$11.789

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IDEA Electronic Components Group

UK . 407 parts In-Stock

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$14.377

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$13.658

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$12.939

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407

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$12.939

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AZTECH Wire

Italy . 361 parts In-Stock

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$16.168

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Semicontronic

India . 1,062 parts In-Stock

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$28.500

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$27.788

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$27.645

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One Stop Electronics

USA . 1,479 parts In-Stock

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$42.500

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Continental Prestige Electronics

USA . 6,999 parts In-Stock

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Corphita

USA . 2,940 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Argo Parts USA

USA . 705 parts In-Stock

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DigiPath Technology Company

USA . 493 parts In-Stock

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$12.962

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493

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Overview

Experience superior performance and reliability with the Texas Instruments ISO7221BDRG4, a top-of-the-line Other Function Interface IC. Crafted with precision using high-quality materials, this product offers seamless integration and unmatched durability. Ideal for automotive applications, this interface circuit ensures optimal functionality even in challenging environments. Trust in Texas Instruments to deliver cutting-edge solutions that elevate your projects to new heights of success. Take advantage of the value and benefits that the ISO7221BDRG4 provides, and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options and the potential to interface with multiple devices or components.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in demanding environments or applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Interface IC Type: INTERFACE CIRCUIT

Being specifically designed as an interface circuit IC indicates that the product is optimized for handling and processing various types of data signals efficiently.

Technical Specifications

Other Function Interface ICs ISO7221BDRG4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

ISO7221BDRG4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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