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HDC1008YPAT

Texas Instruments

HDC1008YPAT by Texas Instruments

HDC1008YPAT by Texas Instruments is an 8-terminal IC with a supply voltage range of 2.7V to 5V, operating b/w -40°C to 125°C. Its package style is grid array with very thin profile and fine pitch, suitable for automotive applications requiring precise analog circuit functions in a compact form factor.

Median Price

$2.415

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

1+ parts

$0.154

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$0.154

-

-

-

Chip1Stop

Japan . 1 parts In-Stock

1+ parts

$1.220

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$1.220

-

-

-

DigiKey

USA . 223 parts In-Stock

1+ parts

$5.510

100+ parts

$4.175

1k+ parts

-

10k+ parts

-

223

$5.510

$4.175

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-

Mouser Electronics

USA . 30 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.610

10k+ parts

$3.510

30

-

-

$3.610

$3.510

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,574 parts In-Stock

1+ parts

$0.146

100+ parts

-

1k+ parts

-

10k+ parts

-

2,574

$0.146

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-

-

Bristol Electronics

USA . 500 parts In-Stock

1+ parts

$6.922

100+ parts

$2.999

1k+ parts

$2.838

10k+ parts

-

500

$6.922

$2.999

$2.838

-

Vyrian

USA . 3,755 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,755

-

-

-

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Chip Stock

USA . 3,350 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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3,350

-

-

-

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Dan-Mar Components

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

-

-

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-

TME

Poland . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.674

10k+ parts

-

250

-

-

$2.674

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,741 parts In-Stock

1+ parts

$0.139

100+ parts

-

1k+ parts

-

10k+ parts

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2,741

$0.139

-

-

-

Native Components

USA . 12 parts In-Stock

1+ parts

$0.553

100+ parts

-

1k+ parts

-

10k+ parts

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12

$0.553

-

-

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Northwest PG Solutions

USA . 1,730 parts In-Stock

1+ parts

$0.608

100+ parts

-

1k+ parts

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10k+ parts

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1,730

$0.608

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Parana Technologies

USA . 133 parts In-Stock

1+ parts

$18.843

100+ parts

-

1k+ parts

$18.922

10k+ parts

-

133

$18.843

-

$18.922

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DigiPath Technology Company

USA . 2,328 parts In-Stock

1+ parts

$20.749

100+ parts

$19.089

1k+ parts

-

10k+ parts

-

2,328

$20.749

$19.089

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IDEA Electronic Components Group

UK . 838 parts In-Stock

1+ parts

$21.172

100+ parts

$20.113

1k+ parts

$19.055

10k+ parts

-

838

$21.172

$20.113

$19.055

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ChromeModa Solutions

Germany . 757 parts In-Stock

1+ parts

$21.172

100+ parts

$17.361

1k+ parts

-

10k+ parts

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757

$21.172

$17.361

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Perfect Parts

USA . 5,600 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,600

-

-

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Lixinc

USA . 292 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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292

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Overview

Elevate your projects with the HDC1008YPAT by Texas Instruments. Known for their superior quality and cutting-edge technology, Texas Instruments delivers excellence in the semiconductor industry. The HDC1008YPAT offers precise temperature and humidity sensing capabilities, making it ideal for a wide range of applications. Whether you're designing smart home devices or industrial automation systems, this product provides unmatched value, reliability, and performance. Trust Texas Instruments to power your innovations with the HDC1008YPAT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and impact resistance, making it suitable for various applications.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into electronic circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 3 V

The nominal supply voltage of 3V ensures compatibility with a wide range of systems and devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand heat and perform reliably in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to function effectively in cold conditions.

Width (mm): 1.59 mm

The compact width of 1.59mm enables the product to be used in space-constrained applications without sacrificing performance.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures reliable and consistent soldering during the manufacturing process.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating indicates that the product is suitable for use in automotive electronics, meeting stringent industry standards.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density mounting, making the product ideal for compact electronic designs.

Maximum Supply Voltage (Vsup): 5 V

The maximum supply voltage of 5V offers compatibility with a wide range of power sources and ensures versatile use in different applications.

Technical Specifications

Other Function Semiconductors HDC1008YPAT attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PBGA-B8

JESD-609 Code:

e1

Length:

2.04 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.675 mm

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.59 mm

Trade Compliance

HDC1008YPAT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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