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HDC1000YPAT

Texas Instruments

HDC1000YPAT by Texas Instruments

HDC1000YPAT by Texas Instruments is a rectangular, surface-mount IC with 8 terminals. It operates b/w -40 to 125°C and has a supply voltage range of 2.7V to 5.5V. Ideal for automotive applications due to its thin profile and fine pitch design.

Median Price

$6.610

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 3 parts In-Stock

1+ parts

$3.180

100+ parts

-

1k+ parts

-

10k+ parts

-

3

$3.180

-

-

-

DigiKey

USA . 15,862 parts In-Stock

1+ parts

$8.320

100+ parts

$6.388

1k+ parts

$5.837

10k+ parts

$5.643

15,862

$8.320

$6.388

$5.837

$5.643

Element14

Singapore . 218 parts In-Stock

1+ parts

$256.810

100+ parts

$191.970

1k+ parts

$167.310

10k+ parts

-

218

$256.810

$191.970

$167.310

-

Mouser Electronics

USA . 5,944 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.900

10k+ parts

-

5,944

-

-

$4.900

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,392 parts In-Stock

1+ parts

$3.021

100+ parts

-

1k+ parts

-

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4,392

$3.021

-

-

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Vyrian

USA . 3,644 parts In-Stock

1+ parts

$3.180

100+ parts

-

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10k+ parts

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3,644

$3.180

-

-

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Forefront Electronics and Design

USA . 2 parts In-Stock

1+ parts

$24.500

100+ parts

-

1k+ parts

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10k+ parts

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2

$24.500

-

-

-

Chip Stock

USA . 9,900 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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9,900

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-

-

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Prism Electronics

USA . 107 parts In-Stock

1+ parts

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107

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Sensible Micro Corp

USA . 32 parts In-Stock

1+ parts

-

100+ parts

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32

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 828 parts In-Stock

1+ parts

$0.057

100+ parts

-

1k+ parts

-

10k+ parts

$0.055

828

$0.057

-

-

$0.055

Parana Technologies

USA . 2,036 parts In-Stock

1+ parts

$1.754

100+ parts

-

1k+ parts

$2.327

10k+ parts

-

2,036

$1.754

-

$2.327

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DigiPath Technology Company

USA . 1,659 parts In-Stock

1+ parts

$1.932

100+ parts

$1.777

1k+ parts

-

10k+ parts

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1,659

$1.932

$1.777

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ChromeModa Solutions

Germany . 5,839 parts In-Stock

1+ parts

$1.971

100+ parts

$1.616

1k+ parts

-

10k+ parts

-

5,839

$1.971

$1.616

-

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IDEA Electronic Components Group

UK . 732 parts In-Stock

1+ parts

$1.971

100+ parts

-

1k+ parts

$1.774

10k+ parts

-

732

$1.971

-

$1.774

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Corphita

USA . 4,941 parts In-Stock

1+ parts

$2.862

100+ parts

-

1k+ parts

-

10k+ parts

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4,941

$2.862

-

-

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

-

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Lixinc

USA . 9,195 parts In-Stock

1+ parts

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9,195

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-

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A-Z Elektronik GmbH

Germany . 7,365 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,365

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-

-

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Alle Elektronik GmbH

Germany . 4,910 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,910

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-

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Northwest PG Solutions

USA . 1,383 parts In-Stock

1+ parts

-

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1,383

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

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1,000

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Kepictronics

USA . 301 parts In-Stock

1+ parts

-

100+ parts

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301

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Overview

Experience unparalleled quality and innovation with the HDC1000YPAT by Texas Instruments, a leading manufacturer in the semiconductor industry. This cutting-edge product falls under the category of Other Function Semiconductors and is designed with a sleek rectangular package body made of high-quality PLASTIC/EPOXY material. Offering a wide range of applications, this versatile IC type is perfect for automotive use, boasting a temperature grade of AUTOMOTIVE. With a nominal supply voltage of 3V and a terminal pitch of 0.5mm, the HDC1000YPAT delivers exceptional performance in a compact design. Elevate your projects with the value and benefits that only Texas Instruments can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the semiconductor components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Facilitates easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3 V

Operates at a standard supply voltage, making it compatible with a wide range of electronic systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for applications where heat resistance is required.

Minimum Operating Temperature: -40 °C

Maintains stable performance even in low temperature environments, ensuring reliability in various conditions.

Width (mm): 1.59 mm

Compact size allows for space-saving installation in electronic devices without compromising on functionality.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature operation, making it ideal for automotive electronics applications.

Terminal Pitch: 0.5 mm

Fine pitch spacing enables high-density mounting on PCBs, maximizing efficiency in circuit design and layout.

Maximum Supply Voltage (Vsup): 5.5 V

Withstands higher supply voltage levels, offering flexibility for use in systems with varying power requirements.

Technical Specifications

Other Function Semiconductors HDC1000YPAT attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PBGA-B8

JESD-609 Code:

e1

Length:

2.04 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.675 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.59 mm

Trade Compliance

HDC1000YPAT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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