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HDC1010YPAR

Texas Instruments

HDC1010YPAR by Texas Instruments

HDC1010YPAR by Texas Instruments is a surface mount analog circuit with 1 function. It operates at a supply voltage range of 2.7V to 5.5V and has an industrial temperature grade of -40°C to 85°C. It is commonly used in applications requiring precise temperature sensing and control.

Median Price

$2.493

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 130 parts In-Stock

1+ parts

$1.892

100+ parts

$1.427

1k+ parts

-

10k+ parts

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130

$1.892

$1.427

-

-

Chip1Stop

Japan . 392 parts In-Stock

1+ parts

$2.130

100+ parts

$1.667

1k+ parts

$1.620

10k+ parts

-

392

$2.130

$1.667

$1.620

-

Texas Instruments

USA . 11,087 parts In-Stock

1+ parts

$2.493

100+ parts

$2.059

1k+ parts

$1.113

10k+ parts

-

11,087

$2.493

$2.059

$1.113

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DigiKey

USA . 1,731 parts In-Stock

1+ parts

$3.370

100+ parts

$2.510

1k+ parts

$2.234

10k+ parts

-

1,731

$3.370

$2.510

$2.234

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Mouser Electronics

USA . 251 parts In-Stock

1+ parts

$3.370

100+ parts

$2.510

1k+ parts

$2.220

10k+ parts

$2.080

251

$3.370

$2.510

$2.220

$2.080

Verical

USA . 130 parts In-Stock

1+ parts

-

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130

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ozdisan Elektronik

Türkiye . 5,974 parts In-Stock

1+ parts

$1.466

100+ parts

-

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-

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5,974

$1.466

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-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.720

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-

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10

$1.720

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-

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Digiode

USA . 4,289 parts In-Stock

1+ parts

$1.797

100+ parts

-

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4,289

$1.797

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Chip Stock

USA . 18,010 parts In-Stock

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18,010

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NAC Semi

USA . 4,774 parts In-Stock

1+ parts

-

100+ parts

$4.320

1k+ parts

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$3.990

4,774

-

$4.320

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$3.990

Cyclops Electronics Ltd

UK . 4,086 parts In-Stock

1+ parts

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4,086

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Vyrian

USA . 3,644 parts In-Stock

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3,644

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TME

Poland . 3,000 parts In-Stock

1+ parts

-

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$2.370

3,000

-

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$2.370

A&K Electronics

USA . 1,961 parts In-Stock

1+ parts

-

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1,961

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Bristol Electronics

USA . 1,961 parts In-Stock

1+ parts

-

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1,961

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Sensible Micro Corp

USA . 1,041 parts In-Stock

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1,041

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,474 parts In-Stock

1+ parts

$1.610

100+ parts

-

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3,474

$1.610

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Semicontronic

India . 3,248 parts In-Stock

1+ parts

$1.610

100+ parts

$1.570

1k+ parts

$1.562

10k+ parts

-

3,248

$1.610

$1.570

$1.562

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Corphita

USA . 4,840 parts In-Stock

1+ parts

$1.703

100+ parts

-

1k+ parts

-

10k+ parts

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4,840

$1.703

-

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Continental Prestige Electronics

USA . 4,919 parts In-Stock

1+ parts

$1.720

100+ parts

-

1k+ parts

-

10k+ parts

$1.686

4,919

$1.720

-

-

$1.686

Argo Parts USA

USA . 4,094 parts In-Stock

1+ parts

$1.720

100+ parts

-

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4,094

$1.720

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-

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Netroflash

USA . 500 parts In-Stock

1+ parts

$1.720

100+ parts

-

1k+ parts

$1.634

10k+ parts

$1.600

500

$1.720

-

$1.634

$1.600

Parana Technologies

USA . 301 parts In-Stock

1+ parts

$12.419

100+ parts

-

1k+ parts

$12.861

10k+ parts

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301

$12.419

-

$12.861

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DigiPath Technology Company

USA . 2,273 parts In-Stock

1+ parts

$13.675

100+ parts

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2,273

$13.675

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ChromeModa Solutions

Germany . 2,469 parts In-Stock

1+ parts

$13.954

100+ parts

$11.442

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-

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2,469

$13.954

$11.442

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IDEA Electronic Components Group

UK . 1,385 parts In-Stock

1+ parts

$13.954

100+ parts

$13.256

1k+ parts

$12.559

10k+ parts

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1,385

$13.954

$13.256

$12.559

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S.R.D Solutions

India . 26,200 parts In-Stock

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26,200

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Lixinc

USA . 10,285 parts In-Stock

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10,285

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Futuretech Components

Singapore . 9,000 parts In-Stock

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9,000

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Technoshack Inc. (Excess)

Canada . 7,200 parts In-Stock

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7,200

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A-Z Elektronik GmbH

Germany . 7,188 parts In-Stock

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7,188

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GreenTree Electronics

Israel . 2,974 parts In-Stock

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2,974

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 188 parts In-Stock

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188

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Formix International (Excess)

India . 43 parts In-Stock

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43

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Overview

Experience the next level of temperature and humidity sensing with the HDC1010YPAR by Texas Instruments. As a leading manufacturer in the semiconductor industry, Texas Instruments brings you a high-quality product that offers exceptional value and benefits for your applications. Whether you're working in industrial environments or building smart home systems, this innovative sensor provides accurate measurements and reliable performance. With its compact design, surface mount capability, and wide operating temperature range, the HDC1010YPAR is the perfect choice for your temperature and humidity monitoring needs. Trust Texas Instruments for cutting-edge technology and superior quality.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This product has a plastic/epoxy package body material, which provides durability and protection to the semiconductor components, making it suitable for various industrial applications.

Surface Mount:

YES - With surface mount capability, this product can be easily mounted on a PCB, saving space and simplifying the assembly process for electronic devices.

No. of Functions:

1 - Having a single function simplifies the usage and integration of this semiconductor into electronic circuits, allowing for more straightforward design and implementation.

Package Shape:

RECTANGULAR - The rectangular package shape offers compatibility with standard PCB layouts, enabling easy integration into existing electronic systems and reducing design complexity.

Nominal Supply Voltage (Vsup):

3 V - With a nominal supply voltage of 3V, this semiconductor is optimized to operate efficiently within that voltage range, ensuring stable performance and power consumption in compatible devices.

No. of Terminals:

8 - The presence of 8 terminals provides a sufficient number of input and output connections, allowing for versatile connectivity options and facilitating the desired functionalities of the product.

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH - The grid array, very thin profile, and fine pitch package style offer high density mounting capabilities, making it suitable for applications where space-saving and performance are crucial.

Maximum Operating Temperature:

85 °C - With a maximum operating temperature of 85°C, this product can withstand higher temperatures without experiencing performance degradation, ensuring reliable operation in demanding environments.

Minimum Operating Temperature:

40 °C - The product's minimum operating temperature of -40°C indicates its ability to withstand extremely low temperatures, making it suitable for applications in cold environments.

Terminal Finish:

TIN SILVER COPPER - The terminal finish of tin silver copper provides enhanced conductivity, corrosion resistance, and solderability, resulting in improved electrical performance and reliability of the semiconductor.

Terminal Position:

BOTTOM - The bottom terminal position facilitates easy and effective PCB mounting, enabling efficient heat dissipation and optimal electrical connections for improved overall performance.

Maximum Seated Height:

0.675 mm - The low maximum seated height of 0.675 mm allows for the semiconductor to be integrated into compact products, where space constraints are a concern, without compromising functionality or performance.

Other IC type:

ANALOG CIRCUIT - This product being an analog circuit provides precise and accurate signal processing capabilities, making it suitable for applications requiring high fidelity conversions, such as audio or sensor interfaces.

Minimum Supply Voltage (Vsup):

2.7 V - With a minimum supply voltage of 2.7V, this semiconductor offers compatibility with a wide range of power sources, ensuring versatility and flexibility in various electronic applications.

Maximum Time At Peak Reflow Temperature (s):

30 - The maximum time at peak reflow temperature of 30 seconds indicates the product's ability to withstand the required temperature during assembly processes, ensuring proper soldering and preventing any damage.

Peak Reflow Temperature °C:

260 - The peak reflow temperature of 260°C ensures reliable solder joints during the assembly process, contributing to the overall quality and durability of the product.

Temperature Grade:

INDUSTRIAL - The industrial temperature grade certification assures that this semiconductor is designed to withstand harsh operating conditions, including wide temperature ranges, making it suitable for demanding industrial applications.

Terminal Form:

BALL - The ball terminal form allows for efficient electrical connections, minimizing signal loss and ensuring reliable transmission, making it ideal for high-speed digital or analog applications.

Terminal Pitch:

0.5 mm - With a terminal pitch of 0.5 mm, this product offers compatibility with compact PCB layouts, enabling the integration of the semiconductor into space-constrained electronic devices while maintaining electrical integrity.

Moisture Sensitivity Level (MSL):

1 - The moisture sensitivity level of 1 indicates that this product has been designed and packaged to withstand standard moisture exposure during storage and manufacturing processes, ensuring long-term reliability.

Maximum Supply Voltage (Vsup):

5.5 V - With a maximum supply voltage of 5.5V, this semiconductor can handle higher voltage inputs, providing compatibility with a wider range of electronic systems and applications.

Technical Specifications

Other Function Semiconductors HDC1010YPAR attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PBGA-B8

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.675 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

HDC1010YPAR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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