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HDC1050DMBR

Texas Instruments

HDC1050DMBR by Texas Instruments

HDC1050DMBR by Texas Instruments is a small outline analog circuit with 6 terminals, suitable for automotive applications. It operates b/w -40 to 125°C, with supply voltage ranging from 2.7V to 5.5V. This surface-mount sensor has a square shape and very thin profile, making it ideal for compact designs.

Median Price

$5.688

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 616 parts In-Stock

1+ parts

$8.510

100+ parts

$6.540

1k+ parts

$6.400

10k+ parts

$5.665

616

$8.510

$6.540

$6.400

$5.665

Rochester

USA . 5,413 parts In-Stock

1+ parts

-

100+ parts

$4.550

1k+ parts

$4.070

10k+ parts

$3.830

5,413

-

$4.550

$4.070

$3.830

Verical

USA . 5,413 parts In-Stock

1+ parts

-

100+ parts

$5.688

1k+ parts

$5.088

10k+ parts

$4.787

5,413

-

$5.688

$5.088

$4.787

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,656 parts In-Stock

1+ parts

$4.170

100+ parts

-

1k+ parts

-

10k+ parts

-

1,656

$4.170

-

-

-

Vyrian

USA . 4,372 parts In-Stock

1+ parts

$4.390

100+ parts

-

1k+ parts

-

10k+ parts

-

4,372

$4.390

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 842 parts In-Stock

1+ parts

$0.042

100+ parts

-

1k+ parts

-

10k+ parts

$0.041

842

$0.042

-

-

$0.041

Semicontronic

India . 5,902 parts In-Stock

1+ parts

$3.730

100+ parts

$3.637

1k+ parts

$3.618

10k+ parts

-

5,902

$3.730

$3.637

$3.618

-

Ampacity Inc.

Singapore . 5,540 parts In-Stock

1+ parts

$3.730

100+ parts

-

1k+ parts

-

10k+ parts

-

5,540

$3.730

-

-

-

Corphita

USA . 424 parts In-Stock

1+ parts

$3.951

100+ parts

-

1k+ parts

-

10k+ parts

-

424

$3.951

-

-

-

Corohmni

South Africa . 148 parts In-Stock

1+ parts

$4.390

100+ parts

-

1k+ parts

-

10k+ parts

-

148

$4.390

-

-

-

Parana Technologies

USA . 1,118 parts In-Stock

1+ parts

$6.560

100+ parts

-

1k+ parts

$7.301

10k+ parts

-

1,118

$6.560

-

$7.301

-

DigiPath Technology Company

USA . 1,698 parts In-Stock

1+ parts

$7.224

100+ parts

-

1k+ parts

-

10k+ parts

-

1,698

$7.224

-

-

-

IDEA Electronic Components Group

UK . 2,266 parts In-Stock

1+ parts

$7.371

100+ parts

-

1k+ parts

$6.634

10k+ parts

-

2,266

$7.371

-

$6.634

-

ChromeModa Solutions

Germany . 1,731 parts In-Stock

1+ parts

$7.371

100+ parts

$6.044

1k+ parts

-

10k+ parts

-

1,731

$7.371

$6.044

-

-

Lixinc

USA . 4,392 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,392

-

-

-

-

Northwest PG Solutions

USA . 1,113 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,113

-

-

-

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Overview

Experience the unparalleled quality and innovation of Texas Instruments with the HDC1050DMBR. This cutting-edge semiconductor offers a wide range of applications in various industries, providing customers with reliable and efficient solutions. With its advanced technology and durable construction, this product ensures top-notch performance and longevity. Trust in Texas Instruments to deliver exceptional value and benefits to meet all your semiconductor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a variety of applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and resources during production.

Nominal Supply Voltage (Vsup): 3 V

Operates at a standard voltage level, ensuring compatibility with common power sources.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold environments, enhancing its versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides good conductivity and corrosion resistance, ensuring reliable performance over time.

Width (mm): 3 mm

Compact size allows for flexibility in PCB layout and saves space in applications with size constraints.

Other IC type: ANALOG CIRCUIT

Designed for analog signal processing, suitable for applications requiring precise and accurate voltage levels.

Maximum Supply Voltage (Vsup): 5.5 V

Wide voltage range allows for compatibility with different power sources, increasing the product's versatility.

Technical Specifications

Other Function Semiconductors HDC1050DMBR attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

HDC1050DMBR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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