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HDC1010YPAT

Texas Instruments

HDC1010YPAT by Texas Instruments

HDC1010YPAT by Texas Instruments is an industrial-grade analog circuit IC with a supply voltage range of 2.7V to 5.5V and operating temperatures from -40°C to 85°C. This rectangular package features a grid array style with very thin profile and fine pitch, suitable for surface mount applications. With a terminal pitch of 0.5mm and bottom position, it offers precise temperature sensing capabilities in various electronic devices.

Median Price

$2.890

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 6,478 parts In-Stock

1+ parts

$3.900

100+ parts

$2.445

1k+ parts

-

10k+ parts

-

6,478

$3.900

$2.445

-

-

Mouser Electronics

USA . 19,522 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.880

10k+ parts

$1.820

19,522

-

-

$1.880

$1.820

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$2.004

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$2.004

-

-

-

Digiode

USA . 2,672 parts In-Stock

1+ parts

$3.857

100+ parts

-

1k+ parts

-

10k+ parts

-

2,672

$3.857

-

-

-

Chip Stock

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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18,000

-

-

-

-

Vyrian

USA . 12,796 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,796

-

-

-

-

Inventory MP

USA . 4,744 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,744

-

-

-

-

Bristol Electronics

USA . 4,744 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,744

-

-

-

-

Sensible Micro Corp

USA . 2,542 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,542

-

-

-

-

NexGen Digital

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 13,192 parts In-Stock

1+ parts

$1.600

100+ parts

-

1k+ parts

-

10k+ parts

-

13,192

$1.600

-

-

-

Semicontronic

India . 12,787 parts In-Stock

1+ parts

$1.600

100+ parts

$1.560

1k+ parts

$1.552

10k+ parts

-

12,787

$1.600

$1.560

$1.552

-

Continental Prestige Electronics

USA . 4,046 parts In-Stock

1+ parts

$2.004

100+ parts

-

1k+ parts

-

10k+ parts

$1.964

4,046

$2.004

-

-

$1.964

Argo Parts USA

USA . 2,603 parts In-Stock

1+ parts

$2.004

100+ parts

-

1k+ parts

-

10k+ parts

-

2,603

$2.004

-

-

-

Corphita

USA . 3,132 parts In-Stock

1+ parts

$3.654

100+ parts

-

1k+ parts

-

10k+ parts

-

3,132

$3.654

-

-

-

Corohmni

South Africa . 57 parts In-Stock

1+ parts

$9.930

100+ parts

-

1k+ parts

-

10k+ parts

-

57

$9.930

-

-

-

Parana Technologies

USA . 2,079 parts In-Stock

1+ parts

$18.831

100+ parts

-

1k+ parts

$18.908

10k+ parts

-

2,079

$18.831

-

$18.908

-

DigiPath Technology Company

USA . 1,173 parts In-Stock

1+ parts

$20.735

100+ parts

$19.076

1k+ parts

-

10k+ parts

-

1,173

$20.735

$19.076

-

-

ChromeModa Solutions

Germany . 6,103 parts In-Stock

1+ parts

$21.158

100+ parts

$17.350

1k+ parts

-

10k+ parts

-

6,103

$21.158

$17.350

-

-

IDEA Electronic Components Group

UK . 1,246 parts In-Stock

1+ parts

$21.158

100+ parts

$20.100

1k+ parts

$19.042

10k+ parts

-

1,246

$21.158

$20.100

$19.042

-

Lixinc

USA . 10,847 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10,847

-

-

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Epart123

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 966 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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966

-

-

-

-

Overview

Elevate your projects with the HDC1010YPAT by Texas Instruments, a top-tier manufacturer known for cutting-edge semiconductor technology. This versatile component is a game-changer in the realm of analog circuits, boasting a durable plastic/epoxy package and surface-mount design for seamless integration. With a wide operating temperature range and high-quality construction, this component is ideal for a range of industrial applications. Experience the value and reliability that Texas Instruments brings to the table with the HDC1010YPAT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability for long-term use.

Surface Mount: YES

Being surface mount compatible makes installation and soldering easy and efficient.

Nominal Supply Voltage (Vsup): 3 V

Operates efficiently at a standard 3V supply voltage, suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Temperature Grade: INDUSTRIAL

Designed for industrial use, ensuring high performance and reliability in demanding environments.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a maximum supply voltage of 5.5V, offering flexibility in power requirements.

Technical Specifications

Other Function Semiconductors HDC1010YPAT attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PBGA-B8

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.675 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

HDC1010YPAT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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